Ball grid array package and process for manufacturing same

Abstract

A ball grid array integrated circuit package is manufactured by mounting a semiconductor die, to a first surface of a substrate such that bumps on the semiconductor die are electrically connected to conductive traces of the substrate. At least one collapsible spacer is mounted to at least one of a heat spreader, the semiconductor die and the substrate. The heat spreader is fixed to the at least one of the first surface of the substrate and the semiconductor die such that the at least one collapsible spacer is disposed therebetween. A ball grid array is formed on a second surface of the substrate, bumps of the ball grid array being electrically connected to the conductive traces and the integrated circuit package is singulated.

1 .- 30 . (canceled)  
     
     
         31 . An integrated circuit package comprising: 
 a substrate having a plurality of conductive traces;    a semiconductor die flip-chip mounted to a first surface of said substrate, bumps of said semiconductor die being electrically connected to said ones of said plurality of conductive traces;    a heat spreader fixed to both said semiconductor die and said substrate by a plurality of collapsible spacers, one of said collapsible spacers disposed between and in contact with said heat spreader and said semiconductor die and further ones of said collapsible spacers disposed between and in contact with said heat spreader and said substrate; and    a ball grid array on a second surface of said substrate, bumps of said ball grid array being electrically connected to said conductive traces; and    a molding compound encapsulating the semiconductor die and said collapsible spacers between the substrate and the heat spreader.    
     
     
         32 . The integrated circuit package according to  claim 31 , further comprising an underfill material disposed between said semiconductor die and said substrate.  
     
     
         33 . An integrated circuit package comprising: 
 a substrate having a plurality of conductive traces;    a semiconductor die flip-chip mounted to a first surface of said substrate, bumps of said semiconductor die being electrically connected to said ones of said plurality of conductive traces;    a heat spreader fixed to both said semiconductor die and said substrate by a plurality of collapsible spacers, one of said collapsible spacers disposed between and in contact with said heat spreader and said semiconductor die and further ones of said collapsible spacers disposed between and in contact with said heat spreader and said substrate; and    a ball grid array on a second surface of said substrate, bumps of said ball grid array being electrically connected to said conductive traces, wherein said collapsible spacers comprise one of solder and a thermoplastic; and    a molding compound encapsulating the semiconductor die and said collapsible spacers between the substrate and the heat spreader.    
     
     
         34 . The integrated circuit package according to  claim 33 , further comprising an underfill material disposed between said semiconductor die and said substrate.