Inventor · disambiguated record
Xiaoguang Zeng
Also filed as: ZENG XIAOGUANG
8 granted patents·4 pending applications·73 citations·filing 2004–2025
84Inventor score
Technology areasH10W
Files withALPHA & OMEGA SEMICONDUCTOR INT LP4GEM SERVICES INC4ALPHA & OMEGA SEMICONDUCTOR1ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD1GEM Services1
Top patents by PatentIndex Score
12 records- 0192US7382044B1Semiconductor device package diepad having features formed by electroplatingGEM SERVICES INC·Filed 2006·Granted Jun 3, 2008·24 cites·8 claims
- 0286US7122406B1Semiconductor device package diepad having features formed by electroplatingGEM SERVICES INC·Filed 2004·Granted Oct 17, 2006·38 cites·10 claims
- 0378US10600727B2Molded intelligent power module for motorsALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2018·Granted Mar 24, 2020·4 cites·20 claims
- 0477US8669650B2Flip chip semiconductor deviceZHANG XIAOTIAN·Filed 2011·Granted Mar 11, 2014·5 cites·27 claims
- 0568US12261101B2Semiconductor package having wettable lead flanks and tie bars and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2022·Granted Mar 25, 2025·0 cites·13 claims
- 0666US9437587B2Flip chip semiconductor deviceALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Sep 6, 2016·2 cites·19 claims
- 0766US2025183132A1Semiconductor package having wettable lead flanks and tie bars and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2025·Application pending·0 cites
- 0860US2025266333A1Semiconductor package having partially plated lead flank and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2024·Application pending·0 cites
- 0951US2008142936A1Semiconductor device package diepad having features formed by electroplatingGEM SERVICES INC·Filed 2008·Application pending·0 cites
- 1046US2011003439A1Semiconductor device package having features formed by electroplatingGEM Services·Filed 2010·Application pending·0 cites
- 1145US12142548B2Semiconductor package having mold locking featureALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2021·Granted Nov 12, 2024·0 cites·12 claims
- 1232US7553700B2Chemical-enhanced package singulation processGEM SERVICES INC·Filed 2004·Granted Jun 30, 2009·0 cites·9 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →