Assignee
GEM SERVICES INC
US·45 granted patents·10 pending applications·483 citations·filing 2001–2012
Top patents by PatentIndex Score
55 records- 0193US8358017B2Semiconductor package featuring flip-chip die sandwiched between metal layersGEM SERVICES INC·Filed 2008·Granted Jan 22, 2013·29 cites·22 claims
- 0292US7382044B1Semiconductor device package diepad having features formed by electroplatingGEM SERVICES INC·Filed 2006·Granted Jun 3, 2008·24 cites·8 claims
- 0392USD465207SLeadframe matrix for a surface mount packageGEM SERVICES INC·Filed 2001·Granted Nov 5, 2002·50 cites·1 claims
- 0489US7057273B2Surface mount packageGEM SERVICES INC·Filed 2001·Granted Jun 6, 2006·47 cites·6 claims
- 0587US7838339B2Semiconductor device package having features formed by stampingGEM SERVICES INC·Filed 2008·Granted Nov 23, 2010·14 cites·19 claims
- 0686US7122406B1Semiconductor device package diepad having features formed by electroplatingGEM SERVICES INC·Filed 2004·Granted Oct 17, 2006·38 cites·10 claims
- 0782US7215012B2Space-efficient package for laterally conducting deviceGEM SERVICES INC·Filed 2003·Granted May 8, 2007·25 cites·6 claims
- 0876US7667309B2Space-efficient package for laterally conducting deviceGEM SERVICES INC·Filed 2008·Granted Feb 23, 2010·5 cites·7 claims
- 0976USD471165SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Mar 4, 2003·21 cites·1 claims
- 1073US7691670B2Interconnection of lead frame to die utilizing flip chip processGEM SERVICES INC·Filed 2008·Granted Apr 6, 2010·5 cites·19 claims
- 1166USD588080S2021-8J matrix leadframeGEM SERVICES INC·Filed 2007·Granted Mar 10, 2009·16 cites·1 claims
- 1258USD484858SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Jan 6, 2004·10 cites·1 claims
- 1355USD492266SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Jun 29, 2004·9 cites·1 claims
- 1455USD484859SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Jan 6, 2004·9 cites·1 claims
- 1555USD484104SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Dec 23, 2003·9 cites·1 claims
- 1655USD483336SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Dec 9, 2003·9 cites·1 claims
- 1754USD588557S4040-28J matrix leadframeGEM SERVICES INC·Filed 2007·Granted Mar 17, 2009·10 cites·1 claims
- 1853USD488136SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Apr 6, 2004·8 cites·1 claims
- 1953USD487432SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Mar 9, 2004·8 cites·1 claims
- 2053USD487431SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Mar 9, 2004·8 cites·1 claims
- 2153USD485244SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Jan 13, 2004·8 cites·1 claims
- 2252US7485498B2Space-efficient package for laterally conducting deviceGEM SERVICES INC·Filed 2007·Granted Feb 3, 2009·0 cites·5 claims
- 2351US2008142936A1Semiconductor device package diepad having features formed by electroplatingGEM SERVICES INC·Filed 2008·Application pending·0 cites
- 2450USD485808SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Jan 27, 2004·7 cites·1 claims
- 2550USD484103SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Dec 23, 2003·7 cites·1 claims
- 2650USD483337SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Dec 9, 2003·7 cites·1 claims
- 2750USD462062SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 27, 2002·7 cites·1 claims
- 2850USD461172SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 6, 2002·7 cites·1 claims
- 2950US2007007640A1Surface mount packageGEM SERVICES INC·Filed 2006·Application pending·0 cites
- 3048USD494939SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Aug 24, 2004·6 cites·1 claims
- 3148USD491900SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Jun 22, 2004·6 cites·1 claims
- 3248USD486802SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Feb 17, 2004·6 cites·1 claims
- 3348USD467231SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Dec 17, 2002·6 cites·1 claims
- 3448US2013105974A1Semiconductor package featuring flip-chip die sandwiched between metal layersGEM SERVICES INC·Filed 2012·Application pending·0 cites
- 3547USD513608SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Jan 17, 2006·6 cites·1 claims
- 3647USD505122SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted May 17, 2005·6 cites·1 claims
- 3747USD505121SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted May 17, 2005·6 cites·1 claims
- 3847USD485243SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Jan 13, 2004·6 cites·1 claims
- 3947USD461170SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 6, 2002·6 cites·1 claims
- 4047US2005145998A1Surface mount packageGEM SERVICES INC·Filed 2005·Application pending·0 cites
- 4146US2008135991A1Semiconductor device package featuring encapsulated leadframe with projecting bumps or ballsGEM SERVICES INC·Filed 2006·Application pending·0 cites
- 4245USD467884SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Dec 31, 2002·5 cites·1 claims
- 4345USD467885SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Dec 31, 2002·5 cites·1 claims
- 4445USD467560SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Dec 24, 2002·5 cites·1 claims
- 4542USD461783SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 20, 2002·4 cites·1 claims
- 4641US2008111219A1Package designs for vertical conduction dieGEM SERVICES INC·Filed 2006·Application pending·0 cites
- 4739USD560623SQuad-24JW surface mount packageGEM SERVICES INC·Filed 2005·Granted Jan 29, 2008·4 cites·1 claims
- 4839USD461784SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 20, 2002·3 cites·1 claims
- 4939USD461459SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 13, 2002·3 cites·1 claims
- 5039US2013017652A1Method of manufacturing a semiconductor device package with a heatsinkGEM SERVICES INC·Filed 2012·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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