Inventor · disambiguated record
Kenro Nakamura
Also filed as: NAKAMURA KENRO
13 granted patents·4 pending applications·250 citations·filing 1998–2016
92Inventor score
Top patents by PatentIndex Score
17 records- 0195US7367873B2Substrate processing apparatusEBARA CORP·Filed 2003·Granted May 6, 2008·55 cites·9 claims
- 0293US7066787B2Substrate processing apparatusTOSHIBA KK·Filed 2004·Granted Jun 27, 2006·49 cites·20 claims
- 0392US7351131B2Method for manufacturing semiconductor device and polishing apparatusTOSHIBA KK·Filed 2005·Granted Apr 1, 2008·20 cites·7 claims
- 0491US6933234B2Method for manufacturing semiconductor device and polishing apparatusTOSHIBA KK·Filed 2002·Granted Aug 23, 2005·50 cites·16 claims
- 0584US6429134B1Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2000·Granted Aug 6, 2002·33 cites·16 claims
- 0671US6620336B2Polishing pad, polishing apparatus and polishing methodTOSHIBA KK·Filed 2001·Granted Sep 16, 2003·14 cites·13 claims
- 0770US9287225B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2014·Granted Mar 15, 2016·2 cites·21 claims
- 0853US6239032B1Polishing methodTOSHIBA KK·Filed 1998·Granted May 29, 2001·18 cites·2 claims
- 0951US2008188167A1Substrate processing apparatusISHII YOU·Filed 2008·Application pending·0 cites
- 1050US9673147B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2016·Granted Jun 6, 2017·0 cites·19 claims
- 1147US9123717B2Semiconductor device manufacturing method and manufacturing apparatusTOSHIBA KK·Filed 2013·Granted Sep 1, 2015·0 cites·6 claims
- 1242US2005254998A1Reactive detection chip and spotter suitable for manufacturing the chipEBARA CORP·Filed 2005·Application pending·0 cites
- 1341US2011081832A1Polishing device and polishing methodNAKAMURA KENRO·Filed 2010·Application pending·0 cites
- 1438US6096631AMethod of manufacturing semiconductor deviceTOSHIBA KK·Filed 1998·Granted Aug 1, 2000·6 cites·22 claims
- 1536US9865502B2Semiconductor device and method of manufacturing the same semiconductor deviceTOSHIBA MEMORY CORP·Filed 2016·Granted Jan 9, 2018·0 cites·11 claims
- 1633US7354861B1Polishing method and polishing liquidTOSHIBA KK·Filed 1999·Granted Apr 8, 2008·3 cites·8 claims
- 1733US2016064265A1Temporarily bonding support substrate and semiconductor device manufacturing methodTOSHIBA KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →