Polishing device and polishing method

Abstract

In one embodiment, a polishing device includes: a rotatable turntable, a holding unit, a separation wall, a slurry supply tube, and a cooling medium supply tube. On an upper surface of the rotatable turntable, a polishing pad is attached. The holding unit rotatably holds an object to be polished and disposes a polished surface of the object to be polished in a manner to face the polishing pad. The separation wall abuts on the upper surface of the polishing pad and sections the polishing pad into a polished region in which the holding unit is provided and an unpolished region in which the holding unit is not provided. The slurry supply tube supplies a slurry to the upper surface of the polishing pad in a polished region side. The cooling medium supply tube supplies a cooling medium to the upper surface of the polishing pad in the unpolished region.

1 . A polishing device, comprising:
 a rotatable turntable on an upper surface of which a polishing pad is attached;   a holding unit rotatably holding an object to be polished and disposing a polished surface of the object to be polished in a manner to face the polishing pad;   a separation wall abutting on the upper surface of the polishing pad and sectioning the polishing pad into a polished region in which said holding unit is provided and an unpolished region in which said holding unit is not provided;   a slurry supply tube supplying a slurry to the upper surface of the polishing pad in a polished region; and   a cooling medium supply tube supplying a cooling medium to the upper surface of the polishing pad in the unpolished region.   
     
     
         2 . The polishing device as set forth in  claim 1 ,
 wherein the polished region and the unpolished region includes a donut-shaped polish contact surface made as a result that the polishing pad being rotated contacts the holding unit.   
     
     
         3 . The polishing device as set forth in  claim 1 ,
 wherein said separation wall has a U shape in plain view and a bottom portion of the U shape is disposed in a neighborhood of a rotation center of the polishing pad.   
     
     
         4 . The polishing device as set forth in  claim 1 ,
 wherein a constitution material of at least a part of a surface of said separation wall contains any one of polyether ether ketone (PEEK), polyphenylene sulfide (PPS), and fluorine.   
     
     
         5 . The polishing device as set forth in  claim 1 ,
 wherein said cooling medium supply tube is movable in a radial direction of the polishing pad.   
     
     
         6 . The polishing device as set forth in  claim 1 ,
 wherein said cooling medium supply tube supplies a temperature-controlled cooling medium.   
     
     
         7 . The polishing device as set forth in  claim 1 ,
 wherein a plurality of said cooling medium supply tubes is provided along a radial direction of the polishing pad and said cooling medium supply tubes are each independently controlled to supply the cooling medium.   
     
     
         8 . The polishing device as set forth in  claim 1 ,
 wherein said cooling medium supply tube has a showerhead with numerous pores facing the upper surface of the polishing pad.   
     
     
         9 . The polishing device as set forth in  claim 1 ,
 wherein the cooling medium is pure water.   
     
     
         10 . The polishing device as set forth in  claim 1 ,
 wherein the cooling medium is gas.   
     
     
         11 . A polishing method, comprising:
 preparing a rotatable turntable on an upper surface of which a polishing pad is attached;   preparing a holding unit rotatably holding an object to be polished and disposing a polished surface of the object to be polished in a manner to face the polishing pad;   making a separation wall abut on the polishing pad and sectioning the polishing pad into a polished region in which the holding unit is provided and an unpolished region in which the holding unit is not provided;   rotating the turntable thereby to rotate the polishing pad;   supplying a cooling medium cooling a surface of the polishing pad in the unpolished region;   supplying a slurry in the polished region; and   rotating the object to be polished and pressing the object to be polished to the polished region to which the slurry has been supplied.   
     
     
         12 . The polishing method as set forth in  claim 11 ,
 wherein the separation wall has a U shape in plain view and a bottom portion of the U shape is disposed in a neighborhood of a rotation center of the polishing pad.   
     
     
         13 . The polishing method as set forth in  claim 11 ,
 wherein a constitution material of at least a part of a surface of the separation wall contains any one of polyether ether ketone (PEEK), polyphenylene sulfide (PPS), and fluorine.   
     
     
         14 . The polishing method as set forth in  claim 11 ,
 wherein the cooling medium supply tube is movable in a radial direction of the polishing pad.   
     
     
         15 . The polishing method as set forth in  claim 11 ,
 wherein the cooling medium supply tube supplies a temperature-controlled cooling medium.