Inventor · disambiguated record
Mauro Bombonati
Also filed as: BOMBONATI MAURO
4 granted patents·1 pending application·112 citations·filing 2001–2007
79Inventor score
Files withST MICROELECTRONICS SRL5
Top patents by PatentIndex Score
5 records- 0188US6504253B2Structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material composite structure using electric connection structureST MICROELECTRONICS SRL·Filed 2001·Granted Jan 7, 2003·53 cites·26 claims
- 0278US6689627B2Process for manufacturing micromechanical components in a semiconductor material wafer with reduction in the starting wafer thicknessST MICROELECTRONICS SRL·Filed 2001·Granted Feb 10, 2004·37 cites·19 claims
- 0374US6498053B2Process of manufacturing a composite structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor materialST MICROELECTRONICS SRL·Filed 2002·Granted Dec 24, 2002·21 cites·20 claims
- 0454US7595223B2Process for bonding and electrically connecting microsystems integrated in several distinct substratesST MICROELECTRONICS SRL·Filed 2007·Granted Sep 29, 2009·1 cites·24 claims
- 0534US2003109183A1Process for bonding and electrically connecting microsystems integrated in several distinct substratesST MICROELECTRONICS SRL·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →