Inventor · disambiguated record
Boguslaw A. Swedek
Also filed as: SWEDEK BOGUSLAW · SWEDEK BOGUSLAW A
178 granted patents·41 pending applications·3,334 citations·filing 1998–2025
99Inventor score
Files withAPPLIED MATERIALS INC163DAVID JEFFREY DRUE10SWEDEK BOGUSLAW A9BENVEGNU DOMINIC J7IRAVANI HASSAN G5
Top patents by PatentIndex Score
219 records- 0198US7195535B1Metrology for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Mar 27, 2007·40 cites·30 claims
- 0298US7018271B2Method for monitoring a substrate during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2004·Granted Mar 28, 2006·127 cites·14 claims
- 0398US6190234B1Endpoint detection with light beams of different wavelengthsAPPLIED MATERIALS INC·Filed 1999·Granted Feb 20, 2001·309 cites·22 claims
- 0498US6159073AMethod and apparatus for measuring substrate layer thickness during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 1998·Granted Dec 12, 2000·233 cites·28 claims
- 0597US7409260B2Substrate thickness measuring during polishingAPPLIED MATERIALS INC·Filed 2007·Granted Aug 5, 2008·60 cites·19 claims
- 0697US7406394B2Spectra based endpointing for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Jul 29, 2008·38 cites·17 claims
- 0797US7097537B1Determination of position of sensor measurements during polishingAPPLIED MATERIALS INC·Filed 2004·Granted Aug 29, 2006·81 cites·35 claims
- 0897US6924641B1Method and apparatus for monitoring a metal layer during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2000·Granted Aug 2, 2005·63 cites·28 claims
- 0996US9281253B2Determination of gain for eddy current sensorAPPLIED MATERIALS INC·Filed 2013·Granted Mar 8, 2016·28 cites·13 claims
- 1096US9138858B2Thin polishing pad with window and molding processAPPLIED MATERIALS INC·Filed 2013·Granted Sep 22, 2015·12 cites·10 claims
- 1196US8475228B2Polishing pad with partially recessed windowBENVEGNU DOMINIC J·Filed 2011·Granted Jul 2, 2013·16 cites·17 claims
- 1296US8260446B2Spectrographic monitoring of a substrate during processing using index valuesDAVID JEFFREY DRUE·Filed 2010·Granted Sep 4, 2012·14 cites·7 claims
- 1396US7118457B2Method of forming a polishing pad for endpoint detectionAPPLIED MATERIALS INC·Filed 2005·Granted Oct 10, 2006·19 cites·21 claims
- 1496US6296548B1Method and apparatus for optical monitoring in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2000·Granted Oct 2, 2001·132 cites·15 claims
- 1595US8393940B2Molding windows in thin padsSWEDEK BOGUSLAW A·Filed 2010·Granted Mar 12, 2013·15 cites·13 claims
- 1695US8088298B2Spectra based endpointing for chemical mechanical polishingSWEDEK BOGUSLAW A·Filed 2008·Granted Jan 3, 2012·25 cites·12 claims
- 1795US7229340B2Monitoring a metal layer during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Jun 12, 2007·15 cites·23 claims
- 1895US6975107B2Eddy current sensing of metal removal for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Dec 13, 2005·35 cites·14 claims
- 1995US6939198B1Polishing system with in-line and in-situ metrologyAPPLIED MATERIALS INC·Filed 2002·Granted Sep 6, 2005·70 cites·32 claims
- 2095US6280289B1Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layersAPPLIED MATERIALS INC·Filed 1998·Granted Aug 28, 2001·187 cites·22 claims
- 2194US9117751B2Endpointing detection for chemical mechanical polishing based on spectrometryAPPLIED MATERIALS INC·Filed 2013·Granted Aug 25, 2015·8 cites·19 claims
- 2294US8858298B2Polishing pad with two-section window having recessAPPLIED MATERIALS INC·Filed 2013·Granted Oct 14, 2014·7 cites·12 claims
- 2394US8563335B1Method of controlling polishing using in-situ optical monitoring and fourier transformBENVEGNU DOMINIC J·Filed 2012·Granted Oct 22, 2013·16 cites·17 claims
- 2494US8562389B2Thin polishing pad with window and molding processBENVEGNU DOMINIC J·Filed 2008·Granted Oct 22, 2013·20 cites·22 claims
- 2594US8039397B2Using optical metrology for within wafer feed forward process controlAPPLIED MATERIALS INC·Filed 2009·Granted Oct 18, 2011·20 cites·24 claims
- 2694US7774086B2Substrate thickness measuring during polishingAPPLIED MATERIALS INC·Filed 2008·Granted Aug 10, 2010·22 cites·19 claims
- 2794US7112960B2Eddy current system for in-situ profile measurementAPPLIED MATERIALS INC·Filed 2003·Granted Sep 26, 2006·87 cites·28 claims
- 2894US6524165B1Method and apparatus for measuring substrate layer thickness during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2000·Granted Feb 25, 2003·39 cites·17 claims
- 2994US6247998B1Method and apparatus for determining substrate layer thickness during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 1999·Granted Jun 19, 2001·124 cites·50 claims
- 3093US9636797B2Adjusting eddy current measurementsAPPLIED MATERIALS INC·Filed 2014·Granted May 2, 2017·11 cites·19 claims
- 3193US8292693B2Using optical metrology for wafer to wafer feed back process controlDAVID JEFFREY DRUE·Filed 2009·Granted Oct 23, 2012·16 cites·24 claims
- 3293US7621798B1Reducing polishing pad deformationAPPLIED MATERIALS INC·Filed 2007·Granted Nov 24, 2009·19 cites·16 claims
- 3393US7294039B2Polishing system with in-line and in-situ metrologyAPPLIED MATERIALS INC·Filed 2006·Granted Nov 13, 2007·15 cites·4 claims
- 3493US7247080B1Feedback controlled polishing processesAPPLIED MATERIALS INC·Filed 2006·Granted Jul 24, 2007·29 cites·7 claims
- 3593US7101251B2Polishing system with in-line and in-situ metrologyAPPLIED MATERIALS INC·Filed 2005·Granted Sep 5, 2006·15 cites·8 claims
- 3693US7008295B2Substrate monitoring during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Mar 7, 2006·43 cites·53 claims
- 3793US6878038B2Combined eddy current sensing and optical monitoring for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted Apr 12, 2005·40 cites·7 claims
- 3892US12320883B2Resistivity-based adjustment of thresholds for in-situ monitoringAPPLIED MATERIALS INC·Filed 2021·Granted Jun 3, 2025·1 cites·19 claims
- 3992US8992286B2Weighted regression of thickness maps from spectral dataAPPLIED MATERIALS INC·Filed 2013·Granted Mar 31, 2015·9 cites·20 claims
- 4092US8977379B2Endpoint method using peak location of spectra contour plots versus timeDAVID JEFFREY DRUE·Filed 2010·Granted Mar 10, 2015·8 cites·18 claims
- 4192US8284560B2Eddy current sensor with enhanced edge resolutionIRAVANI HASSAN G·Filed 2009·Granted Oct 9, 2012·24 cites·22 claims
- 4292US7513818B2Polishing endpoint detection system and method using friction sensorAPPLIED MATERIALS INC·Filed 2004·Granted Apr 7, 2009·41 cites·24 claims
- 4392US7024268B1Feedback controlled polishing processesAPPLIED MATERIALS INC·Filed 2003·Granted Apr 4, 2006·43 cites·9 claims
- 4492US6383058B1Adaptive endpoint detection for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2000·Granted May 7, 2002·63 cites·33 claims
- 4591US10994389B2Polishing apparatus using neural network for monitoringAPPLIED MATERIALS INC·Filed 2018·Granted May 4, 2021·11 cites·20 claims
- 4691US10391610B2Core configuration for in-situ electromagnetic induction monitoring systemAPPLIED MATERIALS INC·Filed 2017·Granted Aug 27, 2019·6 cites·20 claims
- 4791US8535115B2Gathering spectra from multiple optical headsDAVID JEFFREY DRUE·Filed 2011·Granted Sep 17, 2013·8 cites·25 claims
- 4891US8352061B2Semi-quantitative thickness determinationAPPLIED MATERIALS INC·Filed 2008·Granted Jan 8, 2013·14 cites·21 claims
- 4991US8125654B2Methods and apparatus for measuring substrate edge thickness during polishingBENVEGNU DOMINIC J·Filed 2009·Granted Feb 28, 2012·19 cites·16 claims
- 5091US7952708B2High throughput measurement systemAPPLIED MATERIALS INC·Filed 2008·Granted May 31, 2011·13 cites·21 claims
Showing the top 50 of 219 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →