Inventor · disambiguated record
Ying-Chou Tsai
Also filed as: TSAI YING-CHOU
29 granted patents·4 pending applications·574 citations·filing 2000–2020
96Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD29HSIAO WEI-CHUNG1PREC IND CO LTD SILICONWARE1SILICONWARE PREDISION IND CO L1TANG SHAO-TZU1
Top patents by PatentIndex Score
33 records- 0197US6787918B1Substrate structure of flip chip packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Sep 7, 2004·135 cites·13 claims
- 0297US6573610B1Substrate of semiconductor package for flip chip packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jun 3, 2003·133 cites·16 claims
- 0388US6391683B1Flip-chip semiconductor package structure and process for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted May 21, 2002·46 cites·7 claims
- 0486US6391682B1Method of performing flip-chip underfill in a wire-bonded chip-on-chip ball-grid array integrated circuit package moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted May 21, 2002·42 cites·13 claims
- 0584US6380633B1Pattern layout structure in substrateSILICONWARE PREDISION IND CO L·Filed 2000·Granted Apr 30, 2002·47 cites·12 claims
- 0683US6498054B1Method of underfilling a flip-chip semiconductor deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Dec 24, 2002·36 cites·8 claims
- 0783US6404064B1Flip-chip bonding structure on substrate for flip-chip package applicationSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jun 11, 2002·38 cites·12 claims
- 0878US6772512B2Method of fabricating a flip-chip ball-grid-array package without causing mold flashSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Aug 10, 2004·33 cites·6 claims
- 0975US9978673B2Package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted May 22, 2018·3 cites·26 claims
- 1074US9699910B2Circuit structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Jul 4, 2017·2 cites·5 claims
- 1174US6489180B1Flip-chip packaging process utilizing no-flow underfill techniqueSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Dec 3, 2002·21 cites·18 claims
- 1272US10833394B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Nov 10, 2020·1 cites·32 claims
- 1372US9362217B2Package on package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Jun 7, 2016·3 cites·10 claims
- 1471US6348740B1Bump structure with dopantsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Feb 19, 2002·17 cites·8 claims
- 1568US9991197B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jun 5, 2018·1 cites·9 claims
- 1668US8810045B2Packaging substrate and semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Aug 19, 2014·2 cites·9 claims
- 1768US6600232B2Flip-chip semiconductor package structure and process for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Jul 29, 2003·12 cites·5 claims
- 1867US10872847B2Package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Dec 22, 2020·1 cites·10 claims
- 1963US11404361B2Method for fabricating package structure having encapsulate sensing chipSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·12 claims
- 2060US8796867B2Semiconductor package and fabrication method thereofHSIAO WEI CHUNG·Filed 2012·Granted Aug 5, 2014·1 cites·10 claims
- 2157US10201090B2Fabrication method of circuit structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 5, 2019·0 cites·9 claims
- 2253US9112063B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 18, 2015·0 cites·13 claims
- 2352US9006039B2Fabrication method of packaging substrate, and fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Apr 14, 2015·0 cites·9 claims
- 2450US9899235B2Fabrication method of packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 20, 2018·0 cites·12 claims
- 2550US2015144384A1Packaging substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2648US11114393B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Sep 7, 2021·0 cites·20 claims
- 2748US10224243B2Method of fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Mar 5, 2019·0 cites·11 claims
- 2847US9265154B2Packaging substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 16, 2016·0 cites·14 claims
- 2947US9165789B2Fabrication method of packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Oct 20, 2015·0 cites·4 claims
- 3047US2014091462A1Semiconductor package and fabrication method thereofPREC IND CO LTD SILICONWARE·Filed 2012·Application pending·0 cites
- 3146US9805979B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Oct 31, 2017·0 cites·5 claims
- 3237US2019043819A1Electronic package having redistribution structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 3337US2013292832A1Semiconductor package and fabrication method thereofTANG SHAO-TZU·Filed 2012·Application pending·0 cites
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