Inventor · disambiguated record
Julian Gonska
Also filed as: GONSKA JULIAN
14 granted patents·4 pending applications·42 citations·filing 2004–2015
87Inventor score
Top patents by PatentIndex Score
18 records- 0188US8035209B2Micromechanical device which has cavities having different internal atmospheric pressuresBOSCH GMBH ROBERT·Filed 2009·Granted Oct 11, 2011·22 cites·3 claims
- 0280US9725309B2Micromechanical sensor device and corresponding manufacturing methodBOSCH GMBH ROBERT·Filed 2015·Granted Aug 8, 2017·2 cites·12 claims
- 0375US7495302B2Micromechanical component having a diaphragmBOSCH GMBH ROBERT·Filed 2005·Granted Feb 24, 2009·8 cites·8 claims
- 0473US9567212B2Micromechanical componentBOSCH GMBH ROBERT·Filed 2013·Granted Feb 14, 2017·2 cites·12 claims
- 0567US9670055B2Micromechanical sensor unit and method for manufacturing micromechanical sensor unitsBOSCH GMBH ROBERT·Filed 2014·Granted Jun 6, 2017·1 cites·7 claims
- 0661US9123716B2Method for bonding two silicon substrates, and a correspondeing system of two silicon substratesGONSKA JULIAN·Filed 2012·Granted Sep 1, 2015·1 cites·14 claims
- 0758US7572660B2Electrical through-plating of semiconductor chipsBOSCH GMBH ROBERT·Filed 2004·Granted Aug 11, 2009·6 cites·12 claims
- 0846US9567205B2Micromechanical sensor device with a getter in an enclosed cavityBOSCH GMBH ROBERT·Filed 2014·Granted Feb 14, 2017·0 cites·4 claims
- 0944US8975118B2Component having a via and method for manufacturing itGONSKA JULIAN·Filed 2011·Granted Mar 10, 2015·0 cites·5 claims
- 1044US2016368763A1Method for producing a micromechanical componentBOSCH GMBH ROBERT·Filed 2014·Application pending·0 cites
- 1143US2015137329A1Component having a via and method for manufacturing itBOSCH GMBH ROBERT·Filed 2015·Application pending·0 cites
- 1242US2008254635A1Method for Accelerated Etching of SiliconBENZEL HUBERT·Filed 2006·Application pending·0 cites
- 1341US9593011B2Micromechanical component and method for producing a micromechanical componentGONSKA JULIAN·Filed 2010·Granted Mar 14, 2017·0 cites·6 claims
- 1439US7026224B2Method for dicing semiconductor chips and corresponding semiconductor chip systemBOSCH GMBH ROBERT·Filed 2004·Granted Apr 11, 2006·0 cites·13 claims
- 1538US9988261B2Micromechanical device and method for manufacturing a micromechanical deviceBOSCH GMBH ROBERT·Filed 2013·Granted Jun 5, 2018·0 cites·5 claims
- 1638US9650240B2Component including two semiconductor elements, which are bonded to one another via a structured bonding layer, and method for manufacturing a component of this typeBOSCH GMBH ROBERT·Filed 2015·Granted May 16, 2017·0 cites·6 claims
- 1738US2013285175A1Micromechanical component and method for manufacturing a micromechanical componentGONSKA JULIAN·Filed 2013·Application pending·0 cites
- 1833US8530260B2Method for attaching a first carrier device to a second carrier device and micromechanical componentsGONSKA JULIAN·Filed 2010·Granted Sep 10, 2013·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →