Inventor · disambiguated record
Jin Z. Wallner
Also filed as: WALLNER JIN · WALLNER JIN Z · WALLNER JIN ZHENG
12 granted patents·1 pending application·69 citations·filing 2008–2019
89Inventor score
Top patents by PatentIndex Score
13 records- 0196US9917103B1Diffusion break forming after source/drain forming and related IC structureGLOBALFOUNDRIES INC·Filed 2017·Granted Mar 13, 2018·26 cites·18 claims
- 0290US9887135B1Methods for providing variable feature widths in a self-aligned spacer-mask patterning processGLOBALFOUNDRIES INC·Filed 2017·Granted Feb 6, 2018·7 cites·20 claims
- 0387US9171935B2FinFET formation with late fin revealIBM·Filed 2014·Granted Oct 27, 2015·9 cites·20 claims
- 0484US8940634B2Overlapping contacts for semiconductor deviceENGEL BRETT H·Filed 2011·Granted Jan 27, 2015·8 cites·12 claims
- 0580US9899257B1Etch stop liner for contact punch through mitigation in SOI substrateGLOBALFOUNDRIES INC·Filed 2017·Granted Feb 20, 2018·3 cites·19 claims
- 0680US9412843B2Method for embedded diamond-shaped stress elementIBM·Filed 2014·Granted Aug 9, 2016·4 cites·20 claims
- 0777US7883953B2Method for transistor fabrication with optimized performanceFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Feb 8, 2011·7 cites·18 claims
- 0868US10580684B2Self-aligned single diffusion break for fully depleted silicon-on-insulator and method for producing the sameGLOBALFOUNDRIES INC·Filed 2018·Granted Mar 3, 2020·1 cites·7 claims
- 0967US8787074B2Static random access memory test structurePATTERSON OLIVER D·Filed 2011·Granted Jul 22, 2014·2 cites·20 claims
- 1061US9418982B2Multi-layered integrated circuit with selective temperature coefficient of resistanceIBM·Filed 2014·Granted Aug 16, 2016·1 cites·20 claims
- 1155US8124534B2Multiple exposure and single etch integration methodWALLNER JIN·Filed 2008·Granted Feb 28, 2012·1 cites·24 claims
- 1249US11056591B2Epitaxial structures of semiconductor devices that are independent of local pattern densityGLOBALFOUNDRIES US INC·Filed 2019·Granted Jul 6, 2021·0 cites·20 claims
- 1349US2013241070A1Overlapping contacts for semiconductor deviceIBM·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →