Inventor · disambiguated record
Patrick Underwood
Also filed as: UNDERWOOD PATRICK · UNDERWOOD PATRICK K
12 granted patents·6 pending applications·6 citations·filing 2006–2023
83Inventor score
Top patents by PatentIndex Score
18 records- 0192US11421311B2ECAE materials for high strength aluminum alloysHONEYWELL INT INC·Filed 2020·Granted Aug 23, 2022·2 cites·20 claims
- 0287US11649535B2ECAE processing for high strength and high hardness aluminum alloysHONEYWELL INT INC·Filed 2019·Granted May 16, 2023·1 cites·15 claims
- 0381US11981991B2Sputter trap having a thin high purity coating layer and method of making the sameHONEYWELL INT INC·Filed 2023·Granted May 14, 2024·0 cites·20 claims
- 0481US11584985B2Sputter trap having a thin high purity coating layer and method of making the sameHONEYWELL INT INC·Filed 2019·Granted Feb 21, 2023·2 cites·15 claims
- 0579US12252770B2ECAE processing for high strength and high hardness aluminum alloysHONEYWELL INT INC·Filed 2023·Granted Mar 18, 2025·0 cites·10 claims
- 0673US10655212B2Sputter trap having multimodal particle size distributionHONEYWELL INT INC·Filed 2017·Granted May 19, 2020·1 cites·18 claims
- 0771US10851447B2ECAE materials for high strength aluminum alloysHONEYWELL INT INC·Filed 2017·Granted Dec 1, 2020·0 cites·8 claims
- 0870US11248286B2ECAE materials for high strength aluminum alloysHONEYWELL INT INC·Filed 2020·Granted Feb 15, 2022·0 cites·9 claims
- 0970US10968510B2Sputter trap having multimodal particle size distributionHONEYWELL INT INC·Filed 2020·Granted Apr 6, 2021·0 cites·19 claims
- 1058US11450516B2Large-grain tin sputtering targetHONEYWELL INT INC·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
- 1156US10760156B2Copper manganese sputtering targetHONEYWELL INT INC·Filed 2018·Granted Sep 1, 2020·0 cites·22 claims
- 1250US11035036B2Method of forming copper alloy sputtering targets with refined shape and microstructureHONEYWELL INT INC·Filed 2019·Granted Jun 15, 2021·0 cites·19 claims
- 1350US2021383304A1Method and apparatus for improving risk profile for information technology change management systemJPMORGAN CHASE BANK NA·Filed 2021·Application pending·0 cites
- 1438US2010319898A1Thermal interconnect and integrated interface systems, methods of production and uses thereofUNDERWOOD PATRICK K·Filed 2009·Application pending·0 cites
- 1535US2008296756A1Heat spreader compositions and materials, integrated circuitry, methods of production and uses thereofKOCH JAMES L·Filed 2007·Application pending·0 cites
- 1634US2017229295A1Sputtering device component with modified surface and method of makingHONEYWELL INT INC·Filed 2016·Application pending·0 cites
- 1731US2016182526A1Social network privacy management systems and methodsFACEBOOK INC·Filed 2015·Application pending·0 cites
- 1829US2007166554A1Thermal interconnect and interface systems, methods of production and uses thereofRUCHERT BRIAN D·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →