US2010319898A1PendingUtilityA1

Thermal interconnect and integrated interface systems, methods of production and uses thereof

Individually held — no corporate assignee on recordPriority: Mar 13, 2008Filed: Mar 5, 2009Published: Dec 23, 2010
Est. expiryMar 13, 2028(~1.6 yrs left)· nominal 20-yr term from priority
H10W 40/259H10W 40/258H10W 40/255H10W 40/254H10W 46/00H10W 40/735H10W 40/77H10W 40/25H10W 40/251Y10T29/4935
38
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

Heat spreader assemblies are disclosed that include a heat spreader component, at least one coupling layer, and at least one thermally conductive layer, wherein the heat spreader component is coupled to the at least one thermally conductive layer through the at least one coupling layer. In some instances, heat spreader assemblies include an aluminum-based heat spreader component, at least one coupling layer, wherein the coupling layer comprises zinc, a zinc-based material, tin, a tin-based material or a combination thereof, and at least one thermally conductive layer comprising nickel, wherein the heat spreader component is coupled to the at least one thermally conductive layer through the at least one coupling layer. Methods of forming heat spreader assemblies are also disclosed that include providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; providing at least one coupling material, wherein the coupling material is directly deposited onto the bottom surface of the heat spreader component; and depositing, applying or coating at least one thermally conductive coating, film or layer on at least part of the bottom surface of the heat spreader component. In several embodiments, heat spreader component comprises a native oxide layer, an oxide barrier layer or a combination thereof that is removed before application of the at least one coupling material.

Claims

exact text as granted — not AI-modified
1 . A heat spreader assembly, comprising:
 a heat spreader component,   at least one coupling layer, and   at least one thermally conductive layer, wherein the heat spreader component is coupled to the at least one thermally conductive layer through the at least one coupling layer.   
     
     
         2 . The heat spreader assembly of  claim 1 , wherein the heat spreader component comprises an oxide-producing material. 
     
     
         3 . The heat spreader assembly of  claim 2 , wherein the oxide-producing material comprises aluminum. 
     
     
         4 . The heat spreader assembly of  claim 1 , wherein the heat spreader component comprised an oxide layer, an oxide barrier layer or a combination thereof. 
     
     
         5 . The heat spreader assembly of  claim 1 , wherein the at least one coupling layer comprises zinc, zinc-based materials, tin, tin-based materials or combinations thereof. 
     
     
         6 . The heat spreader assembly of  claim 5 , wherein the at least one coupling layer comprises zinc or a zinc-based material. 
     
     
         7 . The heat spreader assembly of  claim 5 , wherein the at least one coupling layer comprises tin or a tin-based material. 
     
     
         8 . The heat spreader assembly of  claim 1 , wherein the at least one thermally conductive layer comprises nickel, gold, indium, palladium, silver, tin, bismuth, ruthenium or a combination thereof. 
     
     
         9 . The heat spreader assembly of  claim 8 , wherein the at least one thermally conductive layer comprises nickel. 
     
     
         10 . The heat spreader assembly of  claim 1 , further comprising at least one additional layer. 
     
     
         11 . The heat spreader assembly of  claim 10 , wherein the at least one additional layer comprises at least one thermal interface material. 
     
     
         12 . A method of forming a heat spreader assembly, comprising:
 providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material;   providing at least one coupling material, wherein the coupling material is directly deposited onto the bottom surface of the heat spreader component; and   depositing, applying or coating at least one thermally conductive coating, film or layer on at least part of the bottom surface of the heat spreader component.   
     
     
         13 . The method of  claim 12 , further comprising cleaning the heat spreader component prior to depositing the at least one coupling material. 
     
     
         14 . The method of  claim 12 , wherein the heat spreader component comprises a native oxide layer, an oxide barrier layer or a combination thereof. 
     
     
         15 . The method of  claim 14 , further comprising removing the native oxide layer, the oxide barrier layer or the combination thereof by an etching process. 
     
     
         16 . The method of  claim 12 , wherein the at least one thermally conductive coating, film or layer is LASER marked or treated after coating. 
     
     
         17 . The method of  claim 12 , further comprising depositing, applying or coating an at least one thermal interface material or another material onto at least part of at least one of the surfaces of the heat spreader component or heat spreader assembly. 
     
     
         18 . The method of  claim 12 , further comprising depositing or applying at least one additional component onto at least part of at least one of the surfaces of the heat spreader component or heat spreader assembly. 
     
     
         19 . The method of  claim 18 , wherein the at least one additional component comprises a die heater, a heat sink or a combination thereof. 
     
     
         20 . A heat spreader assembly, comprising:
 an aluminum-based heat spreader component,   at least one coupling layer, wherein the coupling layer comprises zinc, a zinc-based material, tin, a tin-based material or a combination thereof, and   at least one thermally conductive layer comprising nickel, wherein the heat spreader component is coupled to the at least one thermally conductive layer through the at least one coupling layer.

Join the waitlist — get patent alerts

Track US2010319898A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.