Thermal interconnect and integrated interface systems, methods of production and uses thereof
Abstract
Heat spreader assemblies are disclosed that include a heat spreader component, at least one coupling layer, and at least one thermally conductive layer, wherein the heat spreader component is coupled to the at least one thermally conductive layer through the at least one coupling layer. In some instances, heat spreader assemblies include an aluminum-based heat spreader component, at least one coupling layer, wherein the coupling layer comprises zinc, a zinc-based material, tin, a tin-based material or a combination thereof, and at least one thermally conductive layer comprising nickel, wherein the heat spreader component is coupled to the at least one thermally conductive layer through the at least one coupling layer. Methods of forming heat spreader assemblies are also disclosed that include providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; providing at least one coupling material, wherein the coupling material is directly deposited onto the bottom surface of the heat spreader component; and depositing, applying or coating at least one thermally conductive coating, film or layer on at least part of the bottom surface of the heat spreader component. In several embodiments, heat spreader component comprises a native oxide layer, an oxide barrier layer or a combination thereof that is removed before application of the at least one coupling material.
Claims
exact text as granted — not AI-modified1 . A heat spreader assembly, comprising:
a heat spreader component, at least one coupling layer, and at least one thermally conductive layer, wherein the heat spreader component is coupled to the at least one thermally conductive layer through the at least one coupling layer.
2 . The heat spreader assembly of claim 1 , wherein the heat spreader component comprises an oxide-producing material.
3 . The heat spreader assembly of claim 2 , wherein the oxide-producing material comprises aluminum.
4 . The heat spreader assembly of claim 1 , wherein the heat spreader component comprised an oxide layer, an oxide barrier layer or a combination thereof.
5 . The heat spreader assembly of claim 1 , wherein the at least one coupling layer comprises zinc, zinc-based materials, tin, tin-based materials or combinations thereof.
6 . The heat spreader assembly of claim 5 , wherein the at least one coupling layer comprises zinc or a zinc-based material.
7 . The heat spreader assembly of claim 5 , wherein the at least one coupling layer comprises tin or a tin-based material.
8 . The heat spreader assembly of claim 1 , wherein the at least one thermally conductive layer comprises nickel, gold, indium, palladium, silver, tin, bismuth, ruthenium or a combination thereof.
9 . The heat spreader assembly of claim 8 , wherein the at least one thermally conductive layer comprises nickel.
10 . The heat spreader assembly of claim 1 , further comprising at least one additional layer.
11 . The heat spreader assembly of claim 10 , wherein the at least one additional layer comprises at least one thermal interface material.
12 . A method of forming a heat spreader assembly, comprising:
providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; providing at least one coupling material, wherein the coupling material is directly deposited onto the bottom surface of the heat spreader component; and depositing, applying or coating at least one thermally conductive coating, film or layer on at least part of the bottom surface of the heat spreader component.
13 . The method of claim 12 , further comprising cleaning the heat spreader component prior to depositing the at least one coupling material.
14 . The method of claim 12 , wherein the heat spreader component comprises a native oxide layer, an oxide barrier layer or a combination thereof.
15 . The method of claim 14 , further comprising removing the native oxide layer, the oxide barrier layer or the combination thereof by an etching process.
16 . The method of claim 12 , wherein the at least one thermally conductive coating, film or layer is LASER marked or treated after coating.
17 . The method of claim 12 , further comprising depositing, applying or coating an at least one thermal interface material or another material onto at least part of at least one of the surfaces of the heat spreader component or heat spreader assembly.
18 . The method of claim 12 , further comprising depositing or applying at least one additional component onto at least part of at least one of the surfaces of the heat spreader component or heat spreader assembly.
19 . The method of claim 18 , wherein the at least one additional component comprises a die heater, a heat sink or a combination thereof.
20 . A heat spreader assembly, comprising:
an aluminum-based heat spreader component, at least one coupling layer, wherein the coupling layer comprises zinc, a zinc-based material, tin, a tin-based material or a combination thereof, and at least one thermally conductive layer comprising nickel, wherein the heat spreader component is coupled to the at least one thermally conductive layer through the at least one coupling layer.Join the waitlist — get patent alerts
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