Inventor · disambiguated record
Gowri Kamarthy
Also filed as: KAMARTHY GOWRI · KAMARTHY GOWRI CHANNA
16 granted patents·8 pending applications·523 citations·filing 2009–2024
93Inventor score
Top patents by PatentIndex Score
24 records- 0196US9252238B1Semiconductor structures with coplanar recessed gate layers and fabrication methodsGLOBALFOUNDRIES INC·Filed 2014·Granted Feb 2, 2016·427 cites·20 claims
- 0296US9245761B2Internal plasma grid for semiconductor fabricationLAM RES CORP·Filed 2013·Granted Jan 26, 2016·21 cites·19 claims
- 0394US10141163B2Controlling ion energy within a plasma chamberLAM RES CORP·Filed 2016·Granted Nov 27, 2018·8 cites·20 claims
- 0493US10224221B2Internal plasma grid for semiconductor fabricationLAM RES CORP·Filed 2016·Granted Mar 5, 2019·7 cites·20 claims
- 0593US9460894B2Controlling ion energy within a plasma chamberLAM RES CORP·Filed 2013·Granted Oct 4, 2016·11 cites·20 claims
- 0692US8852964B2Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basisLAM RES CORP·Filed 2013·Granted Oct 7, 2014·14 cites·18 claims
- 0791US9230819B2Internal plasma grid applications for semiconductor fabrication in context of ion-ion plasma processingLAM RES CORP·Filed 2014·Granted Jan 5, 2016·15 cites·30 claims
- 0890US9633846B2Internal plasma grid applications for semiconductor fabricationLAM RES CORP·Filed 2015·Granted Apr 25, 2017·8 cites·23 claims
- 0981US9012243B2Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basisLAM RES CORP·Filed 2014·Granted Apr 21, 2015·4 cites·15 claims
- 1078US10424461B2Controlling ion energy within a plasma chamberLAM RES CORP·Filed 2018·Granted Sep 24, 2019·1 cites·21 claims
- 1171US8671878B2Profile and CD uniformity control by plasma oxidation treatmentLAM RES CORP·Filed 2012·Granted Mar 18, 2014·2 cites·15 claims
- 1271US2024387258A1Film stack simplification for high aspect ratio patterning and vertical scalingLAM RES CORP·Filed 2024·Application pending·0 cites
- 1370US8298949B2Profile and CD uniformity control by plasma oxidation treatmentZHONG QINGHUA·Filed 2009·Granted Oct 30, 2012·3 cites·13 claims
- 1458US8999184B2Method for providing viasKUO MING-SHU·Filed 2012·Granted Apr 7, 2015·2 cites·13 claims
- 1554US12080592B2Film stack simplification for high aspect ratio patterning and vertical scalingLAM RES CORP·Filed 2019·Granted Sep 3, 2024·0 cites·8 claims
- 1647US2023320062A1Selective etching and deposition of memory layers to provide capacitor-to-active silicon electrical couplingLAM RES CORP·Filed 2022·Application pending·0 cites
- 1746US2025226233A1In situ declogging in plasma etchingLAM RES CORP·Filed 2021·Application pending·0 cites
- 1844US9589853B2Method of planarizing an upper surface of a semiconductor substrate in a plasma etch chamberLAM RES CORP·Filed 2014·Granted Mar 7, 2017·0 cites·20 claims
- 1944US2022102624A1Ion beam etching with gas treatment and pulsingLAM RES CORP·Filed 2020·Application pending·0 cites
- 2038US9385003B1Residue free systems and methods for isotropically etching silicon in tight spacesLAM RES CORP·Filed 2015·Granted Jul 5, 2016·0 cites·10 claims
- 2138US2014179106A1In-situ metal residue cleanLAM RES CORP·Filed 2012·Application pending·0 cites
- 2236US2014051256A1Etch with mixed mode pulsingZHONG QINGHUA·Filed 2012·Application pending·0 cites
- 2335US2013267097A1Method and apparatus for forming features with plasma pre-etch treatment on photoresistSRIVASTAVA RATNDEEP·Filed 2012·Application pending·0 cites
- 2432US2014030893A1Method for shrink and tune trench/via cdKUO MING-SHU·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →