Inventor · disambiguated record
Michiya Kohiki
Also filed as: KOHIKI MICHIYA
11 granted patents·12 pending applications·20 citations·filing 2007–2019
85Inventor score
Files withJX NIPPON MINING & METALS CORP15KOHIKI MICHIYA6NIPPON MINING AND METALS CO LT1NIPPON MINING CO1
Top patents by PatentIndex Score
23 records- 0185US9028972B2Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board and printed wiring boardKOHIKI MICHIYA·Filed 2011·Granted May 12, 2015·4 cites·13 claims
- 0283US9578741B2Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2013·Granted Feb 21, 2017·4 cites·17 claims
- 0380US10349531B2Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing methodJX NIPPON MINING & METALS CORP·Filed 2016·Granted Jul 9, 2019·3 cites·18 claims
- 0479US9930776B2Ultrathin copper foil and method of manufacturing the same, and ultrathin copper layerJX NIPPON MINING & METALS CORP·Filed 2012·Granted Mar 27, 2018·2 cites·24 claims
- 0577US9788423B2Copper foil with carrierJX NIPPON MINING & METALS CORP·Filed 2016·Granted Oct 10, 2017·1 cites·1 claims
- 0675US10187983B2Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2016·Granted Jan 22, 2019·2 cites·23 claims
- 0767US2020036010A1Negative electrode current collector for secondary batteryJX NIPPON MINING & METALS CORP·Filed 2019·Application pending·0 cites
- 0866US9839124B2Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2016·Granted Dec 5, 2017·1 cites·8 claims
- 0963US10257938B2Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2014·Granted Apr 9, 2019·1 cites·13 claims
- 1062US10178775B2Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2016·Granted Jan 8, 2019·1 cites·21 claims
- 1156US2014346048A1Electrolytic Copper Foil, and Negative Electrode Current Collector for Secondary BatteryJX NIPPON MINING & METALS CORP·Filed 2013·Application pending·0 cites
- 1255US8721864B2Process and apparatus for producing a metal covered polyimide compositeKOHIKI MICHIYA·Filed 2012·Granted May 13, 2014·0 cites·9 claims
- 1353US2018063950A1Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2017·Application pending·0 cites
- 1452US8568899B2Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit boardKOHIKI MICHIYA·Filed 2008·Granted Oct 29, 2013·1 cites·18 claims
- 1548US2010215982A1Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the CompositeNIPPON MINING AND METALS CO LT·Filed 2008·Application pending·0 cites
- 1644US2016381805A1Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devicesJX NIPPON MINING & METALS CORP·Filed 2016·Application pending·0 cites
- 1744US2013256140A1Electrolytic copper foilKOHIKI MICHIYA·Filed 2011·Application pending·0 cites
- 1843US2014318973A1Electrolytic copper foil and production method of electrolytic copper foilKOHIKI MICHIYA·Filed 2012·Application pending·0 cites
- 1942US2010040873A1Two-Layered Copper-Clad LaminateNIPPON MINING CO·Filed 2007·Application pending·0 cites
- 2041US2016374205A1Copper foil with carrier, laminate, method of producing printed wiring board, and method of producing electronic devicesJX NIPPON MINING & METALS CORP·Filed 2016·Application pending·0 cites
- 2138US2017362733A1Copper foil with release layer, laminated material, method for producing printed wiring board, and method for producing electronic apparatusJX NIPPON MINING & METALS CORP·Filed 2017·Application pending·0 cites
- 2236US2016381806A1Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devicesJX NIPPON MINING & METALS CORP·Filed 2016·Application pending·0 cites
- 2333US2014030591A1Electrolytic copper foil for an anode of a negative electrode collector in a secondary battery and method of producing the sameKOHIKI MICHIYA·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →