Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board

Abstract

Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein the specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer is 140 or less.

1 . A copper foil provided with a carrier comprising, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein at least one of the following (a) and (b) is satisfied:
 (a) a specular gloss at 60° in a machine direction (MD) of the intermediate layer side surface of the ultrathin copper layer is 140 or less;   (b) a specular gloss at 60° in a transverse direction (TD) of the intermediate layer side surface of the ultrathin copper layer is 65 or less.   
     
     
         2 . The copper foil provided with a carrier according to  claim 1 , wherein a specular gloss at 60° in a machine direction (MD) of the intermediate layer side surface is 130 or less. 
     
     
         3 . The copper foil provided with a carrier according to  claim 2 , wherein a specular gloss at 60° in a machine direction (MD) of the intermediate layer side surface is 120 or less. 
     
     
         4 . The copper foil provided with a carrier according to  claim 1 , wherein a specular gloss at 60° in a transverse direction (TD) of the intermediate layer side surface of the ultrathin copper layer is 60 or less. 
     
     
         5 . The copper foil provided with a carrier according to  claim 1 , wherein a specular gloss at 60° in a transverse direction (TD) of the intermediate layer side surface of the ultrathin copper layer is 55 or less. 
     
     
         6 . The copper foil provided with a carrier according to  claim 1 , wherein a specular gloss at 60° in a machine direction (MD) of the intermediate layer side surface of the ultrathin copper layer/a specular gloss at 60° in a transverse direction (TD) of the intermediate layer side surface of the ultrathin copper layer is 2.05 or less. 
     
     
         7 . The copper foil provided with a carrier according to  claim 1  comprising:
 one or more layers selected from the group consisting of a roughened layer, a heat resistant layer, an anti-corrosion layer, a chromate-treated layer, and a silane coupling-treated layer, 
 in the case that the copper foil provided with a carrier according to  claim 1  comprises an ultrathin copper layer on one side of the carrier, on at least one surface or both surfaces on the ultrathin copper layer side and the carrier side; or 
 in the case that the copper foil provided with a carrier according to claim I comprises an ultrathin copper layer on both sides of the carrier, on one or both surface(s) on the ultrathin copper layer side. 
 
     
     
         8 . The copper foil provided with a carrier according to  claim 7 , wherein the roughened layer is a layer consisting of a simple substance selected from the group consisting of copper, nickel, cobalt, phosphorous, tungsten, arsenic, molybdenum, chromium, and zinc, or an alloy comprising one or more thereof. 
     
     
         9 . The copper foil provided with a carrier according to  claim 7  comprising a resin layer provided above one or more layers selected from the group consisting of the roughened layer, the heat resistant layer, an anti-corrosion layer, a chromate-treated layer, and a silane coupling-treated layer. 
     
     
         10 . The copper foil provided with a carrier according to  claim 1  comprising a resin layer provided above the ultrathin copper layer. 
     
     
         11 . The copper foil provided with a carrier according to  claim 9 , wherein the resin layer is a resin for adhesion and/or a resin in a semi-cured state. 
     
     
         12 . A laminate fabricated using a copper foil provided with a carrier according to  claim 1 . 
     
     
         13 . A laminate comprising a copper foil provided with a carrier according to  claim 1  and a resin, wherein a part or all of an edge face of the copper foil provided with a carrier is covered with the resin. 
     
     
         14 . A laminate, wherein one copper foil provided with a carrier according to  claim 1  is laminated from the carrier side or the ultrathin copper layer side on the carrier side or the ultrathin copper layer side of another copper foil provided with a carrier according to  claim 1 . 
     
     
         15 . A printed wiring board fabricated using a copper foil provided with a carrier according to  claim 1 . 
     
     
         11 . An electronic device fabricated using a printed wiring board according to  claim 15 . 
     
     
         17 . A method for fabricating a printed wiring board comprising:
 forming a copper-clad laminate by carrying out   a step of preparing a copper foil provided with a carrier according to  claim 1  and an insulating substrate,   a step of laminating the copper foil provided with a carrier and the insulating substrate, and   a step of, after the copper foil provided with a carrier and the insulating substrate have been laminated, peeling the carrier of the copper foil provided with a carrier; and   then forming a circuit by any of a semi-additive method, a subtractive method, a partly additive method, and a modified semi-additive method.   
     
     
         18 . A method for fabricating a printed wiring board comprising:
 a step of forming a circuit on the ultrathin copper layer side surface or the carrier side surface of a copper foil provided with a carrier according to  claim 1 ;   a step of forming a resin layer on the ultrathin copper layer side surface or the carrier side surface of the copper foil provided with a carrier so that the circuit is buried;   a step of forming a circuit on the resin layer;   a step of peeling the carrier or the ultrathin copper layer after forming the circuit on the resin layer; and   a step of exposing the circuit buried in the resin layer that is formed on the ultrathin copper layer side surface or the carrier side surface by, after the carrier or the ultrathin copper layer has been peeled off, removing the ultrathin copper layer or the carrier.   
     
     
         19 . A method for fabricating a printed wiring board comprising:
 a step of laminating the ultrathin copper layer side surface or the carrier side surface of a copper foil provided with a carrier according to  claim 1  and a resin substrate;   a step of providing two layers of a resin layer and a circuit at least one time on the ultrathin copper layer side surface or the carrier side surface of the copper foil provided with a carrier opposite to a side with the resin substrate laminated thereon; and   a step of, after the two layers of the resin layer and the circuit have been formed, peeling the carrier or the ultrathin copper layer from the copper foil provided with a carrier.   
     
     
         20 . A method for fabricating a printed wiring board comprising:
 a step of providing two layers of a resin layer and a circuit at least one time on one side or both sides of a laminate according to  claim 12 ; and   a step of, after the two layers of the resin layer and the circuit have been formed, peeling the carrier or the ultrathin copper layer from the copper foil provided with a carrier constituting the laminate.