Inventor · disambiguated record
Fu-Hsien Wang
Also filed as: WANG FU-HSIEN
5 granted patents·32 citations·filing 2007–2013
76Inventor score
Top patents by PatentIndex Score
5 records- 0191US7452739B2Method of separating semiconductor diesSEMI PHOTONICS CO LTD·Filed 2007·Granted Nov 18, 2008·23 cites·39 claims
- 0277US7968379B2Method of separating semiconductor diesSEMILEDS OPTOELECTRONICS CO·Filed 2008·Granted Jun 28, 2011·5 cites·51 claims
- 0370US8802469B2Method of fabricating semiconductor die using handling layerCHU CHEN-FU·Filed 2011·Granted Aug 12, 2014·1 cites·37 claims
- 0470US8716041B2Method for fabricating side by side light emitting diode (LED) having separate electrical and heat transfer pathsSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted May 6, 2014·2 cites·19 claims
- 0561US8552458B2Side by side light emitting diode (LED) having separate electrical and heat transfer pathsDOAN TRUNG TRI·Filed 2010·Granted Oct 8, 2013·1 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →