Inventor · disambiguated record
Christopher N. Collins
Also filed as: COLLINS CHRISTOPHER · COLLINS CHRISTOPHER N · COLLINS CHRISTOPHER NEAL
10 granted patents·4 pending applications·122 citations·filing 1996–2017
88Inventor score
Top patents by PatentIndex Score
14 records- 0183US10170304B1Self-aligned nanotube structuresGLOBALFOUNDRIES INC·Filed 2017·Granted Jan 1, 2019·3 cites·20 claims
- 0283US5874162AWeighted sintering process and conformable load tileIBM·Filed 1996·Granted Feb 23, 1999·69 cites·11 claims
- 0369US8907494B2Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structuresIBM·Filed 2013·Granted Dec 9, 2014·2 cites·15 claims
- 0464US9252133B2Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structuresGLOBALFOUNDRIES INC·Filed 2014·Granted Feb 2, 2016·1 cites·5 claims
- 0563US5741131AStacking system for substratesIBM·Filed 1996·Granted Apr 21, 1998·11 cites·8 claims
- 0655US6440813B2Process of manufacturing a DRAM cell capacitor having increased trench capacitanceIBM·Filed 2001·Granted Aug 27, 2002·6 cites·6 claims
- 0754US6188096B1DRAM cell capacitor having increased trench capacitanceIBM·Filed 1999·Granted Feb 13, 2001·13 cites·38 claims
- 0852US2015097274A1Through-silicon via structure and method for improving beol dielectric performanceIBM·Filed 2014·Application pending·0 cites
- 0949US2015069608A1Through-silicon via structure and method for improving beol dielectric performanceIBM·Filed 2013·Application pending·0 cites
- 1043US10170337B2Implant after through-silicon via (TSV) etch to getter mobile ionsIBM·Filed 2016·Granted Jan 1, 2019·0 cites·14 claims
- 1143US6328041B1Universal cleaning wafer for a plasma chamberIBM·Filed 1998·Granted Dec 11, 2001·11 cites·21 claims
- 1241US2014061915A1Prevention of thru-substrate via pistoning using highly doped copper alloy seed layerCOLLINS CHRISTOPHER N·Filed 2012·Application pending·0 cites
- 1333US2016379818A1Insulating a via in a semiconductor substrateGLOBALFOUNDRIES INC·Filed 2015·Application pending·0 cites
- 1432US5948193AProcess for fabricating a multilayer ceramic substrate from thin greensheetIBM·Filed 1997·Granted Sep 7, 1999·6 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →