Inventor · disambiguated record
John David Brazzle
Also filed as: BRAZZLE JOHN D · BRAZZLE JOHN DAVID
11 granted patents·6 pending applications·307 citations·filing 1999–2023
90Inventor score
Files withANALOG DEVICES INC5ANALOG DEVICES INTERNATIONAL UNLIMITED CO5UNIV UTAH RES FOUND3CORNING INC2LINEAR TECH CORP1
Top patents by PatentIndex Score
17 records- 0190US6760145B1Actuator for dual-axis rotation micromirrorCORNING INC·Filed 2003·Granted Jul 6, 2004·48 cites·61 claims
- 0289US7015780B2Apparatus, device and method for generating magnetic field gradientCORNING INC·Filed 2002·Granted Mar 21, 2006·41 cites·84 claims
- 0384US10497635B2Stacked circuit package with molded base having laser drilled openings for upper packageLINEAR TECH HOLDING LLC·Filed 2018·Granted Dec 3, 2019·4 cites·27 claims
- 0479US11410977B2Electronic module for high power applicationsANALOG DEVICES INTERNATIONAL UNLIMITED CO·Filed 2019·Granted Aug 9, 2022·3 cites·18 claims
- 0579US7473244B2Active needle devices with integrated functionalityUNIV UTAH RES FOUND·Filed 2001·Granted Jan 6, 2009·90 cites·32 claims
- 0678US11844178B2Electronic componentANALOG DEVICES INTERNATIONAL UNLIMITED CO·Filed 2021·Granted Dec 12, 2023·1 cites·20 claims
- 0774US11272618B2Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuitsANALOG DEVICES INTERNATIONAL UNLIMITED CO·Filed 2017·Granted Mar 8, 2022·2 cites·16 claims
- 0867US7048723B1Surface micromachined microneedlesUNIV UTAH RES FOUND·Filed 1999·Granted May 23, 2006·118 cites·32 claims
- 0962US11749576B2Stacked circuit package with molded base having laser drilled openings for upper packageANALOG DEVICES INTERNATIONAL UNLIMITED CO·Filed 2020·Granted Sep 5, 2023·0 cites·19 claims
- 1060US2025201683A1Molded vertical interconnect arrayANALOG DEVICES INC·Filed 2023·Application pending·0 cites
- 1157US2025183144A1Stacked vertical power moduleANALOG DEVICES INC·Filed 2023·Application pending·0 cites
- 1253US2023335328A1Low profile coupled inductorANALOG DEVICES INC·Filed 2022·Application pending·0 cites
- 1352US11476232B2Three-dimensional packaging techniques for power FET density improvementANALOG DEVICES INTERNATIONAL UNLIMITED CO·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 1452US2017311447A1Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuitsLINEAR TECH CORP·Filed 2017·Application pending·0 cites
- 1550US2009069697A1Active microneedles and microneedle arraysUNIV UTAH RES FOUND·Filed 2008·Application pending·0 cites
- 1643US11270986B2Package with overhang inductorANALOG DEVICES INC·Filed 2020·Granted Mar 8, 2022·0 cites·22 claims
- 1743US2024096775A1Isolated metal clips with structural bridgeANALOG DEVICES INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →