Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits

Abstract

A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module. A method of making a component-on-package circuit may include attaching a component for an electrical circuit to a circuit module. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component after the attachment both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides a spring-like cushioning of force applied to the component in the direction of the circuit module. The circuit module may be encapsulated in molding material after the circuit module has been attached to the component, without encapsulation the component at the same time.

The invention claimed is: 
     
         1 . A component-on-package circuit comprising:
 a component for an electrical circuit; and   a circuit module attached to the component, the circuit module having:
 circuitry; and 
 at least one leadframe which connects the circuitry to the component both electrically and thermally, the leadframe having a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module. 
   
     
     
         2 . The component-on-package circuit of  claim 1  wherein the leadframe has at least one foot electrically connected to the circuitry. 
     
     
         3 . The component-on-package circuit of  claim 2  wherein the leadframe has at least two distinct feet. 
     
     
         4 . The component-on-package circuit of  claim 1  wherein the leadframe has at least one top surface electrically and thermally connected to the component. 
     
     
         5 . The component-on-package circuit of  claim 4  wherein the leadframe has at least two, separated top surfaces that are each attached to the component. 
     
     
         6 . The component-on-package circuit of  claim 1  wherein the leadframe has:
 at least one foot electrically connected to the circuitry; 
 at least one top surface electrically and thermally connected to the component; and 
 at least one step between the foot and the top surface. 
 
     
     
         7 . The component-on-package circuit of  claim 6  wherein the leadframe has at least two distinct steps. 
     
     
         8 . The component-on-package circuit of  claim 7  wherein the at least two distinct steps are at different elevations between the at least one foot and the at least one top surface. 
     
     
         9 . The component-on-package circuit of  claim 7  wherein the at least two distinct steps are at the same elevation. 
     
     
         10 . The component-on-package circuit of  claim 1  wherein:
 the circuit module has a second leadframe that connects the circuitry to the component both electrically and thermally; and 
 the second leadframe has a high degree of both electrical and thermal conductivity and a non-planner shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module. 
 
     
     
         11 . The component-on-package circuit of  claim 1  wherein:
 the circuit module, including the leadframe, is encapsulated in molding material; and 
 the leadframe has a top surface that is not covered by the molding material. 
 
     
     
         12 . The component-on-package circuit of  claim 11  wherein the component is not also encapsulated by the molding material. 
     
     
         13 . The component-on-package circuit of  claim 1  wherein the component is a passive component. 
     
     
         14 . The component-on-package circuit of  claim 13  wherein the passive component is an inductor. 
     
     
         15 . A method of making a component-on-package circuit comprising:
 attaching a component for an electrical circuit to a circuit module, the circuit module having circuitry and at least one leadframe which connects the circuitry to the component after the attachment both electrically and thermally, the leadframe having a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module; and   encapsulating the circuit module in molding material after the circuit module has been attached to the component, without encapsulation the component at the same time.