Inventor · disambiguated record
Praneeth Akkinepally
Also filed as: AKKINEPALLY PRANEETH · AKKINEPALLY PRANEETH KUMAR
17 granted patents·4 pending applications·8 citations·filing 2015–2023
88Inventor score
Files withINTEL CORP21
Top patents by PatentIndex Score
21 records- 0188US11233009B2Embedded multi-die interconnect bridge having a molded region with through-mold viasINTEL CORP·Filed 2020·Granted Jan 25, 2022·2 cites·15 claims
- 0272US11737208B2Microelectronic assemblies having conductive structures with different thicknessesINTEL CORP·Filed 2019·Granted Aug 22, 2023·1 cites·13 claims
- 0371US10410940B2Semiconductor package with cavityINTEL CORP·Filed 2017·Granted Sep 10, 2019·2 cites·11 claims
- 0470US11688692B2Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold viasINTEL CORP·Filed 2021·Granted Jun 27, 2023·0 cites·17 claims
- 0569US10546916B2Package-integrated vertical capacitors and methods of assembling sameINTEL CORP·Filed 2018·Granted Jan 28, 2020·1 cites·9 claims
- 0669US10068776B1Raster-planarized substrate interlayers and methods of planarizing sameINTEL CORP·Filed 2017·Granted Sep 4, 2018·1 cites·22 claims
- 0769US2023345621A1Microelectronic assemblies having conductive structures with different thicknessesINTEL CORP·Filed 2023·Application pending·0 cites
- 0868US11081448B2Embedded die microelectronic device with molded componentINTEL CORP·Filed 2017·Granted Aug 3, 2021·1 cites·15 claims
- 0966US12087700B2Embedded die microelectronic device with molded componentINTEL CORP·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
- 1066US11652071B2Electronic device package including a capacitorINTEL CORP·Filed 2021·Granted May 16, 2023·0 cites·5 claims
- 1163US11296186B2Package-integrated vertical capacitors and methods of assembling sameINTEL CORP·Filed 2020·Granted Apr 5, 2022·0 cites·12 claims
- 1258US11571876B2Dielectric film with pressure sensitive microcapsules of adhesion promoterINTEL CORP·Filed 2017·Granted Feb 7, 2023·0 cites·12 claims
- 1355US12394682B2Organic passivation for fine pitch architecturesINTEL CORP·Filed 2021·Granted Aug 19, 2025·0 cites·20 claims
- 1455US10923443B2Electronic device package including a capacitorINTEL CORP·Filed 2019·Granted Feb 16, 2021·0 cites·25 claims
- 1551US2024222274A1Hybrid integration of back-end-of-line layers for disaggregated technologiesINTEL CORP·Filed 2022·Application pending·0 cites
- 1646US11574874B2Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitchINTEL CORP·Filed 2017·Granted Feb 7, 2023·0 cites·20 claims
- 1745US11462432B2Dual side de-bonding in component carriers using photoablationINTEL CORP·Filed 2018·Granted Oct 4, 2022·0 cites·20 claims
- 1843US11348865B2Electronic device including a substrate having interconnectsINTEL CORP·Filed 2019·Granted May 31, 2022·0 cites·22 claims
- 1943US2023187331A1Interposer with a glass core that includes openings and through glass viasINTEL CORP·Filed 2021·Application pending·0 cites
- 2042US2021090981A1Surface finish surrounding a padINTEL CORP·Filed 2019·Application pending·0 cites
- 2137US10985080B2Electronic package that includes lamination layerINTEL CORP·Filed 2015·Granted Apr 20, 2021·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →