Inventor · disambiguated record
Andreas Zluc
Also filed as: ZLUC ANDREAS
29 granted patents·8 pending applications·58 citations·filing 2008–2025
94Inventor score
Files withAT & S AUSTRIA TECH & SYSTEMTECHNIK AG24AUSTRIA TECH & SYSTEM TECH8WEIDINGER GERALD2AT&SAUSTRIA TECH & SYSTEMTECHNIK AG1WEICHSLBERGER GUENTHER1
Top patents by PatentIndex Score
37 records- 0191US9418930B2Power moduleAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2014·Granted Aug 16, 2016·14 cites·9 claims
- 0289US10617012B2Methods of manufacturing flexible printed circuit boardsAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted Apr 7, 2020·5 cites·16 claims
- 0388US10779413B2Method of embedding a component in a printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2014·Granted Sep 15, 2020·8 cites·13 claims
- 0485US9253888B2Method for integrating an electronic component into a printed circuit board or a printed circuit board intermediate product, and printed circuit board or printed circuit board intermediate productWEIDINGER GERALD·Filed 2012·Granted Feb 2, 2016·9 cites·18 claims
- 0584US10187997B2Method for making contact with a component embedded in a printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2015·Granted Jan 22, 2019·5 cites·7 claims
- 0678US12400968B2Component with dielectric layer for embedding in component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Granted Aug 26, 2025·0 cites·16 claims
- 0776US2025227850A1Method for Embedding a Component in a Printed Circuit BoardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2025·Application pending·0 cites
- 0875US12185478B2Printed circuit board having embedded componentAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Dec 31, 2024·0 cites·19 claims
- 0975US8685196B2Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a methodWEICHSLBERGER GUENTHER·Filed 2010·Granted Apr 1, 2014·5 cites·37 claims
- 1075US2025062171A1Component Carrier With Surface-Contactable Component Embedded in Laminated StackAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2024·Application pending·0 cites
- 1173US11523520B2Method for making contact with a component embedded in a printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Dec 6, 2022·1 cites·25 claims
- 1272US11749613B2Component with dielectric layer for embedding in component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Sep 5, 2023·0 cites·13 claims
- 1369US10765005B2Embedding component with pre-connected pillar in component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Sep 1, 2020·2 cites·11 claims
- 1469US8789271B2Method for integrating an electronic component into a printed circuit boardWEICHSLBERGER GÜNTHER·Filed 2009·Granted Jul 29, 2014·7 cites·13 claims
- 1569US2024030095A1Electronic Package Comprising a Decoupling Layer StructureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Application pending·0 cites
- 1666US12075561B2Embedding component in component carrier by component fixation structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Aug 27, 2024·0 cites·20 claims
- 1765US12501551B2Method for embedding a component in a printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Dec 16, 2025·0 cites·10 claims
- 1864US11749573B2Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavityAUSTRIA TECH & SYSTEM TECH·Filed 2021·Granted Sep 5, 2023·0 cites·9 claims
- 1961US11171092B2Component with dielectric layer for embedding in component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Nov 9, 2021·0 cites·8 claims
- 2061US8541689B2Method for removing a part of a planar material layer and multilayer structureWEIDINGER GERALD·Filed 2008·Granted Sep 24, 2013·2 cites·21 claims
- 2159US12165940B2Component carrier with surface-contactable component embedded in laminated stackAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Dec 10, 2024·0 cites·8 claims
- 2258US12245377B2Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupledAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Mar 4, 2025·0 cites·26 claims
- 2358US2020205296A1Methods of Manufacturing Flexible Electronic DevicesAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Application pending·0 cites
- 2457US11049778B2Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavityAUSTRIA TECH & SYSTEM TECH·Filed 2019·Granted Jun 29, 2021·0 cites·8 claims
- 2555US11682661B2Hermetic optical component package having organic portion and inorganic portionAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Jun 20, 2023·0 cites·13 claims
- 2654US11495513B2Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupledAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Nov 8, 2022·0 cites·20 claims
- 2753US11658142B2Connection arrangement, component carrier and method of forming a component carrier structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted May 23, 2023·0 cites·15 claims
- 2851US2014216795A1Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a methodAUSTRIA TECH & SYSTEM TECH·Filed 2014·Application pending·0 cites
- 2950US12424504B2Component embedded in component carrier and having an exposed side wallAT&SAUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Sep 23, 2025·0 cites·19 claims
- 3047US10426040B2Method for producing a circuit board elementAUSTRIA TECH & SYSTEM TECH·Filed 2014·Granted Sep 24, 2019·0 cites·21 claims
- 3147US2021068252A1Component Carrier and Method of Manufacturing the SameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Application pending·0 cites
- 3247US2014307403A1Method for integrating an electronic component into a printed circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2014·Application pending·0 cites
- 3344US2018177045A1Embedding Component in Component Carrier by Component Fixation StructureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2016·Application pending·0 cites
- 3441US11570897B2Component embedded in component carrier and having an exposed side wallAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Jan 31, 2023·0 cites·19 claims
- 3541US10709023B2Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrateAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted Jul 7, 2020·0 cites·18 claims
- 3635US10306750B2Circuit board and method for manufacturing a circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted May 28, 2019·0 cites·17 claims
- 3733US9967972B2Circuit board having an asymmetric layer structureAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted May 8, 2018·0 cites·17 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →