Inventor · disambiguated record
Kazumi Sugai
Also filed as: SUGAI KAZUMI
16 granted patents·5 pending applications·213 citations·filing 1995–2007
94Inventor score
Top patents by PatentIndex Score
21 records- 0179US6509649B1Semiconductor device and fabricating method thereofNEC CORP·Filed 2000·Granted Jan 21, 2003·25 cites·9 claims
- 0274US6268090B1Process for manufacturing semiconductor device and exposure maskNEC CORP·Filed 2000·Granted Jul 31, 2001·14 cites·7 claims
- 0368US6368981B1Method of manufacturing semiconductor device and chemical mechanical polishing apparatusNEC CORP·Filed 2000·Granted Apr 9, 2002·12 cites·18 claims
- 0465US6496255B2Measurement of crystal face orientationNEC CORP·Filed 2001·Granted Dec 17, 2002·5 cites·46 claims
- 0561US6143671ASemiconductor device manufacturing methodNEC CORP·Filed 1998·Granted Nov 7, 2000·24 cites·14 claims
- 0661US5545591AMethod for forming an aluminum film used as an interconnect in a semiconductor deviceNEC CORP·Filed 1995·Granted Aug 13, 1996·28 cites·7 claims
- 0759US6083832AMethod of manufacturing semiconductor deviceNEC CORP·Filed 1998·Granted Jul 4, 2000·24 cites·20 claims
- 0855US5993546AApparatus for forming a solid thin film from a layer of liquid material without voidNEC CORP·Filed 1997·Granted Nov 30, 1999·17 cites·6 claims
- 0949US6569756B1Method for manufacturing a semiconductor deviceNEC ELECTRONICS CORP·Filed 1999·Granted May 27, 2003·15 cites·3 claims
- 1049US2007145013A1Method for polishing workpiece, polishing apparatus and method for manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 1144US6123992AMethod of forming aluminum interconnection layerNEC CORP·Filed 1998·Granted Sep 26, 2000·11 cites·114 claims
- 1242US6465354B1Method of improving the planarization of wiring by CMPNEC CORP·Filed 1999·Granted Oct 15, 2002·10 cites·19 claims
- 1342US2005136804A1Method for polishing workpiece, polishing apparatus and method for manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Application pending·0 cites
- 1440US6403468B1Method for forming embedded metal wiringNEC CORP·Filed 1999·Granted Jun 11, 2002·8 cites·19 claims
- 1540US6184131B1Process of forming solid thin film from layer of liquid material without void and film forming apparatus used thereinNEC CORP·Filed 1999·Granted Feb 6, 2001·7 cites·11 claims
- 1640US2001026906A1Process for manufacturing semiconductor device and exposure maskNEC CORP·Filed 2001·Application pending·0 cites
- 1738US2003034561A1Semiconductor device and fabricating method thereofFiled 2002·Application pending·0 cites
- 1835US6174563B1Method for forming thin metal filmsNEC CORP·Filed 1998·Granted Jan 16, 2001·5 cites·10 claims
- 1935US2002022441A1Slurry supply apparatus and methodFiled 2001·Application pending·0 cites
- 2034US6114236AProcess for production of semiconductor device having an insulating film of low dielectric constantNEC CORP·Filed 1997·Granted Sep 5, 2000·4 cites·9 claims
- 2133US5793479AThin-film formation device and methodNEC CORP·Filed 1997·Granted Aug 11, 1998·4 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →