Inventor · disambiguated record
Satoshi Uchiya
Also filed as: UCHIYA SATOSHI
15 granted patents·4 pending applications·64 citations·filing 1991–2021
89Inventor score
Top patents by PatentIndex Score
19 records- 0171US9954095B2Semiconductor device and method of manufacturing sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Apr 24, 2018·2 cites·19 claims
- 0262US5567632AMethod for fabricating solid state image sensor device having buried type photodiodeFiled 1993·Granted Oct 22, 1996·25 cites·13 claims
- 0360US9184285B2Semiconductor device with gate electrodes buried in trenchesRENESAS ELECTRONICS CORP·Filed 2013·Granted Nov 10, 2015·1 cites·5 claims
- 0455US7842979B2Solid-state imaging device and method of driving the sameNEC ELECTRONICS CORP·Filed 2009·Granted Nov 30, 2010·0 cites·16 claims
- 0553US6194242B1Fabrication of solid-state imaging device having no transfer error of the signal charge from vertical horizontal charge-transfer sectionNEC CORP·Filed 1999·Granted Feb 27, 2001·13 cites·10 claims
- 0652US11652100B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2021·Granted May 16, 2023·0 cites·19 claims
- 0751US7514729B2Solid-state imaging device and method of driving the sameNEC ELECTRONICS CORP·Filed 2006·Granted Apr 7, 2009·0 cites·16 claims
- 0851US5258608ASolid-state imaging device with anti-reflective layers of amorphous silicon and insulating siliconNEC CORP·Filed 1991·Granted Nov 2, 1993·15 cites·6 claims
- 0950US8089165B2Device comprising electrode padMORIYA TARO·Filed 2009·Granted Jan 3, 2012·0 cites·11 claims
- 1049US8969150B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 3, 2015·0 cites·9 claims
- 1148US9029953B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted May 12, 2015·0 cites·8 claims
- 1248US8803226B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Aug 12, 2014·0 cites·11 claims
- 1346US7547976B2Electrode pad arrangement with open side for waste removalNEC ELECTRONICS CORP·Filed 2005·Granted Jun 16, 2009·0 cites·7 claims
- 1446US2016027916A1Semiconductor device with gate electrodes buried in trenchesRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1545US2015228737A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1645US2006073628A1Solid-state imaging device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2005·Application pending·0 cites
- 1743US6114717ASolid-state imaging device having no transfer error of the signal charges from vertical horizontal charge-transfer sectionNEC CORP·Filed 1997·Granted Sep 5, 2000·8 cites·7 claims
- 1842US2020020799A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 1941US10600904B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Mar 24, 2020·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →