Inventor · disambiguated record
Cai Wang
Also filed as: WANG CAI · WANG CAI-SHENG
8 granted patents·56 citations·filing 2005–2016
81Inventor score
Top patents by PatentIndex Score
8 records- 0194US7670950B2Copper metallization of through silicon viaENTHONE·Filed 2008·Granted Mar 2, 2010·43 cites·21 claims
- 0278US8741390B2Metallic surface enhancementABYS JOSEPH A·Filed 2008·Granted Jun 3, 2014·9 cites·39 claims
- 0363US10103029B2Process for filling vias in the microelectronicsMACDERMID ENTHONE INC·Filed 2016·Granted Oct 16, 2018·1 cites·27 claims
- 0462US7330182B23D graphics processing methodVIA TECH INC·Filed 2005·Granted Feb 12, 2008·3 cites·16 claims
- 0540US10541140B2Process for filling vias in the microelectronicsRICHARDSON THOMAS B·Filed 2012·Granted Jan 21, 2020·0 cites·24 claims
- 0637US8098264B2Method and apparatus for rendering computer graphics primitiveWANG CAI-SHENG·Filed 2008·Granted Jan 17, 2012·0 cites·18 claims
- 0734US9175400B2Immersion tin silver plating in electronics manufactureYAU YUNG-HERNG·Filed 2009·Granted Nov 3, 2015·0 cites·16 claims
- 0833US10221496B2Copper filling of through silicon viasRICHARDSON THOMAS B·Filed 2011·Granted Mar 5, 2019·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →