Inventor · disambiguated record
Chi-Fa Ku
Also filed as: KU CHI-FA
32 granted patents·5 pending applications·147 citations·filing 1997–2018
96Inventor score
Files withUNITED MICROELECTRONICS CORP36
Top patents by PatentIndex Score
37 records- 0196US9564217B1Semiconductor memory device having integrated DOSRAM and NOSRAMUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 7, 2017·18 cites·9 claims
- 0296US9431441B1Image sensor pixel structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 30, 2016·15 cites·20 claims
- 0395US9064719B1Integrated circuit and method of forming integrated circuitUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jun 23, 2015·22 cites·20 claims
- 0490US9412734B2Structure with inductor and MIM capacitorUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 9, 2016·7 cites·14 claims
- 0580US9627549B1Semiconductor transistor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 18, 2017·3 cites·9 claims
- 0680US9455351B1Oxide semiconductor field effect transistor device and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 27, 2016·3 cites·20 claims
- 0776US9893066B2Semiconductor transistor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 13, 2018·2 cites·5 claims
- 0872US9607123B2Method for performing deep n-typed well-correlated (DNW-correlated) antenna rule check of integrated circuit and semiconductor structure complying with DNW-correlated antenna ruleUNITED MICROELECTRONICS CORP·Filed 2015·Granted Mar 28, 2017·2 cites·10 claims
- 0972US6025206AMethod for detecting defectsUNITED MICROELECTRONICS CORP·Filed 1998·Granted Feb 15, 2000·46 cites·13 claims
- 1068US9627547B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 18, 2017·1 cites·20 claims
- 1165US9620649B1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 11, 2017·1 cites·12 claims
- 1264US9966428B2Capacitor and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 8, 2018·1 cites·10 claims
- 1361US10644166B2Method for forming semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 5, 2020·0 cites·17 claims
- 1461US9305994B2Semiconductor apparatus with multi-layer capacitance structureUNITED MICROELECTRONICS CORP·Filed 2014·Granted Apr 5, 2016·1 cites·18 claims
- 1557US10103273B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 16, 2018·0 cites·9 claims
- 1656US11011649B2Oxide semiconductor device and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 18, 2021·0 cites·9 claims
- 1755US10056493B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 21, 2018·0 cites·9 claims
- 1854US9530834B1Capacitor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 27, 2016·0 cites·6 claims
- 1953US10115786B2Capacitor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 30, 2018·0 cites·9 claims
- 2053US10102907B2Method for fabricating semiconductor memory device having integrated DOSRAM and NOSRAMUNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 16, 2018·0 cites·10 claims
- 2153US9887293B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 6, 2018·0 cites·10 claims
- 2250US9577029B2Metal-insulator-metal capacitor structure and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Feb 21, 2017·0 cites·2 claims
- 2349US10043917B2Oxide semiconductor device and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 7, 2018·0 cites·8 claims
- 2449US6304387B1Method of predicting the curvature radius of the microlensUNITED MICROELECTRONICS CORP·Filed 2000·Granted Oct 16, 2001·3 cites·10 claims
- 2547US9851780B2Semiconductor device and operating method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 26, 2017·0 cites·7 claims
- 2647US6422246B1Method removing residual photoresistUNITED MICROELECTRONICS CORP·Filed 2000·Granted Jul 23, 2002·1 cites·4 claims
- 2744US9349873B1Oxide semiconductor device and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 24, 2016·0 cites·20 claims
- 2844US2015264813A1Chip-stack interposer structure including passive device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 2943US5773082AMethod for applying photoresist on waferUNITED MICROELECTRONICS CORP·Filed 1997·Granted Jun 30, 1998·10 cites·13 claims
- 3043US2015137323A1Method for fabricating through silicon via structureUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 3140US2002062838A1Method of removing residual photoresistFiled 2002·Application pending·0 cites
- 3235US2017098599A1Oxide semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 3335US2017084614A1Memory cell with oxide semiconductor field effect transistor device integrated thereinUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 3434US6153360AMethod of removing photo-resistUNITED MICROELECTRONICS CORP·Filed 1998·Granted Nov 28, 2000·5 cites·9 claims
- 3531US6136665AMethod for forming a recess-free buffer layerUNITED MICROELECTRONICS CORP·Filed 1998·Granted Oct 24, 2000·3 cites·16 claims
- 3630US6283134B1Apparatus for removing photo-resistUNITED MICROELECTRONICS CORP·Filed 1998·Granted Sep 4, 2001·3 cites·19 claims
- 3729US6007953AMethod of avoiding peeling on wafer edge and mark numberUNITED MICROELECTRONICS CORP·Filed 1998·Granted Dec 28, 1999·0 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Chi-Fa Ku files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →