Inventor · disambiguated record
Christopher M. Scanlan
Also filed as: SCANLAN CHRISTOPHER · SCANLAN CHRISTOPHER M · SCANLAN CHRISTOPHER MARC
70 granted patents·6 pending applications·3,555 citations·filing 1996–2019
99Inventor score
Files withDECA TECHNOLOGIES INC40AMKOR TECHNOLOGY INC21SCANLAN CHRISTOPHER M6MOTOROLA INC3BERRY CHRISTOPHER J2
Top patents by PatentIndex Score
76 records- 0199US7851894B1System and method for shielding of package on package (PoP) assembliesAMKOR TECHNOLOGY INC·Filed 2008·Granted Dec 14, 2010·114 cites·17 claims
- 0299US7777351B1Thin stacked interposer packageAMKOR TECHNOLOGY INC·Filed 2007·Granted Aug 17, 2010·413 cites·24 claims
- 0399US7633765B1Semiconductor package including a top-surface metal layer for implementing circuit featuresAMKOR TECHNOLOGY INC·Filed 2005·Granted Dec 15, 2009·387 cites·23 claims
- 0499US7342303B1Semiconductor device having RF shielding and method thereforAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 11, 2008·144 cites·20 claims
- 0598US8629546B1Stacked redistribution layer (RDL) die assembly packageSCANLAN CHRISTOPHER M·Filed 2012·Granted Jan 14, 2014·41 cites·20 claims
- 0698US8319338B1Thin stacked interposer packageBERRY CHRISTOPHER J·Filed 2010·Granted Nov 27, 2012·144 cites·20 claims
- 0798US7745910B1Semiconductor device having RF shielding and method thereforAMKOR TECHNOLOGY INC·Filed 2007·Granted Jun 29, 2010·115 cites·20 claims
- 0898US6686649B1Multi-chip semiconductor package with integral shield and antennaAMKOR TECHNOLOGY INC·Filed 2001·Granted Feb 3, 2004·336 cites·11 claims
- 0997US9887103B2Semiconductor device and method of adaptive patterning for panelized packagingDECA TECHNOLOGIES INC·Filed 2015·Granted Feb 6, 2018·40 cites·20 claims
- 1097US9831170B2Fully molded miniaturized semiconductor moduleDECA TECHNOLOGIES INC·Filed 2016·Granted Nov 28, 2017·29 cites·20 claims
- 1197US9040316B1Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clippingDECA TECHNOLOGIES INC·Filed 2014·Granted May 26, 2015·40 cites·23 claims
- 1297US8018068B1Semiconductor package including a top-surface metal layer for implementing circuit featuresAMKOR TECHNOLOGY INC·Filed 2009·Granted Sep 13, 2011·47 cites·10 claims
- 1397US7960827B1Thermal via heat spreader package and methodAMKOR TECHNOLOGY INC·Filed 2009·Granted Jun 14, 2011·114 cites·14 claims
- 1497US7898066B1Semiconductor device having EMI shielding and method thereforAMKOR TECHNOLOGY INC·Filed 2007·Granted Mar 1, 2011·71 cites·11 claims
- 1597US7825520B1Stacked redistribution layer (RDL) die assembly packageAMKOR TECHNOLOGY INC·Filed 2009·Granted Nov 2, 2010·102 cites·20 claims
- 1697US7550857B1Stacked redistribution layer (RDL) die assembly packageAMKOR TECHNOLOGY INC·Filed 2006·Granted Jun 23, 2009·188 cites·15 claims
- 1797US7049682B1Multi-chip semiconductor package with integral shield and antennaTYCO ELECTRONICS LOGISTICS AG·Filed 2003·Granted May 23, 2006·156 cites·14 claims
- 1896US10720417B2Thermally enhanced fully molded fan-out moduleDECA TECHNOLOGIES INC·Filed 2018·Granted Jul 21, 2020·11 cites·20 claims
- 1996US10373902B2Fully molded miniaturized semiconductor moduleDECA TECHNOLOGIES INC·Filed 2017·Granted Aug 6, 2019·14 cites·20 claims
- 2096US9761571B2Thermally enhanced fully molded fan-out moduleDECA TECHNOLOGIES INC·Filed 2016·Granted Sep 12, 2017·13 cites·20 claims
- 2196US9177926B2Semiconductor device and method comprising thickened redistribution layersDECA TECHNOLOGIES INC·Filed 2015·Granted Nov 3, 2015·30 cites·20 claims
- 2296US8203203B1Stacked redistribution layer (RDL) die assembly packageSCANLAN CHRISTOPHER M·Filed 2010·Granted Jun 19, 2012·20 cites·18 claims
- 2396US8093691B1System and method for RF shielding of a semiconductor packageFUENTES RUBEN·Filed 2009·Granted Jan 10, 2012·101 cites·18 claims
- 2495US8799845B2Adaptive patterning for panelized packagingSCANLAN CHRISTOPHER M·Filed 2010·Granted Aug 5, 2014·24 cites·16 claims
- 2595US8796561B1Fan out build up substrate stackable package and methodSCANLAN CHRISTOPHER M·Filed 2009·Granted Aug 5, 2014·38 cites·17 claims
- 2695US8604600B2Fully molded fan-outSCANLAN CHRISTOPHER M·Filed 2011·Granted Dec 10, 2013·17 cites·20 claims
- 2795US8535978B2Die up fully molded fan-out wafer level packagingDECA TECHNOLOGIES INC·Filed 2012·Granted Sep 17, 2013·21 cites·27 claims
- 2894US9613912B2Method of marking a semiconductor packageDECA TECHNOLOGIES INC·Filed 2015·Granted Apr 4, 2017·9 cites·9 claims
- 2994US9466545B1Semiconductor package in packageSCANLAN CHRISTOPHER M·Filed 2007·Granted Oct 11, 2016·29 cites·19 claims
- 3094US8227338B1Semiconductor package including a top-surface metal layer for implementing circuit featuresSCANLAN CHRISTOPHER MARC·Filed 2011·Granted Jul 24, 2012·29 cites·20 claims
- 3194US7829990B1Stackable semiconductor package including laminate interposerAMKOR TECHNOLOGY INC·Filed 2007·Granted Nov 9, 2010·34 cites·19 claims
- 3294US7781852B1Membrane die attach circuit element package and method thereforAMKOR TECHNOLOGY INC·Filed 2006·Granted Aug 24, 2010·42 cites·20 claims
- 3394US7507603B1Etch singulated semiconductor packageAMKOR TECHNOLOGY INC·Filed 2005·Granted Mar 24, 2009·40 cites·20 claims
- 3494US6546620B1Flip chip integrated circuit and passive chip component package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Apr 15, 2003·99 cites·20 claims
- 3594US6356453B1Electronic package having flip chip integrated circuit and passive chip componentAMKOR TECHNOLOGY INC·Filed 2000·Granted Mar 12, 2002·103 cites·15 claims
- 3693US9196509B2Semiconductor device and method of adaptive patterning for panelized packagingDECA TECHNOLOGIES INC·Filed 2013·Granted Nov 24, 2015·16 cites·20 claims
- 3793US5751552ASemiconductor device balancing thermal expansion coefficient mismatchMOTOROLA INC·Filed 1997·Granted May 12, 1998·160 cites·19 claims
- 3892US9576919B2Semiconductor device and method comprising redistribution layersDECA TECHNOLOGIES INC·Filed 2015·Granted Feb 21, 2017·11 cites·17 claims
- 3992US8922021B2Die up fully molded fan-out wafer level packagingDECA TECHNOLOGIES INC·Filed 2013·Granted Dec 30, 2014·12 cites·28 claims
- 4092US8656333B1Integrated circuit package auto-routingBISHOP CRAIG·Filed 2012·Granted Feb 18, 2014·20 cites·19 claims
- 4190US9418905B2Adaptive patterning for panelized packagingDECA TECHNOLOGIES INC·Filed 2013·Granted Aug 16, 2016·8 cites·18 claims
- 4290US9337086B2Die up fully molded fan-out wafer level packagingDECA TECHNOLOGIES INC·Filed 2014·Granted May 10, 2016·10 cites·20 claims
- 4389US10818635B2Fully molded semiconductor package for power devices and method of making the sameDECA TECHNOLOGIES INC·Filed 2019·Granted Oct 27, 2020·5 cites·19 claims
- 4489US10050004B2Fully molded peripheral package on package deviceDECA TECHNOLOGIES INC·Filed 2016·Granted Aug 14, 2018·8 cites·20 claims
- 4588US9754835B2Semiconductor device and method comprising redistribution layersDECA TECHNOLOGIES INC·Filed 2016·Granted Sep 5, 2017·3 cites·19 claims
- 4688US8826221B2Adaptive patterning for panelized packagingDECA TECHNOLOGIES INC·Filed 2013·Granted Sep 2, 2014·7 cites·20 claims
- 4787US9269622B2Semiconductor device and method of land grid array packaging with bussing linesDECA TECHNOLOGIES INC·Filed 2013·Granted Feb 23, 2016·9 cites·20 claims
- 4886US9502397B13D interconnect component for fully molded packagesDECA TECHNOLOGIES INC·Filed 2016·Granted Nov 22, 2016·5 cites·20 claims
- 4985US9768124B2Semiconductor package in packageAMKOR TECHNOLOGY INC·Filed 2016·Granted Sep 19, 2017·4 cites·20 claims
- 5085US9520331B2Adaptive patterning for panelized packagingDECA TECHNOLOGIES INC·Filed 2013·Granted Dec 13, 2016·5 cites·15 claims
Showing the top 50 of 76 patent records by PatentIndex Score.
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