Individual holder
SCANLAN CHRISTOPHER M
US·6 granted patents·169 citations·filing 2007–2012
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
6 records- 0198US8629546B1Stacked redistribution layer (RDL) die assembly packageSCANLAN CHRISTOPHER M·Filed 2012·Granted Jan 14, 2014·41 cites·20 claims
- 0296US8203203B1Stacked redistribution layer (RDL) die assembly packageSCANLAN CHRISTOPHER M·Filed 2010·Granted Jun 19, 2012·20 cites·18 claims
- 0395US8799845B2Adaptive patterning for panelized packagingSCANLAN CHRISTOPHER M·Filed 2010·Granted Aug 5, 2014·24 cites·16 claims
- 0495US8796561B1Fan out build up substrate stackable package and methodSCANLAN CHRISTOPHER M·Filed 2009·Granted Aug 5, 2014·38 cites·17 claims
- 0595US8604600B2Fully molded fan-outSCANLAN CHRISTOPHER M·Filed 2011·Granted Dec 10, 2013·17 cites·20 claims
- 0694US9466545B1Semiconductor package in packageSCANLAN CHRISTOPHER M·Filed 2007·Granted Oct 11, 2016·29 cites·19 claims
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