Assignee
DECA TECHNOLOGIES INC
US·41 granted patents·6 pending applications·372 citations·filing 2011–2020
Top patents by PatentIndex Score
47 records- 0197US9887103B2Semiconductor device and method of adaptive patterning for panelized packagingDECA TECHNOLOGIES INC·Filed 2015·Granted Feb 6, 2018·40 cites·20 claims
- 0297US9831170B2Fully molded miniaturized semiconductor moduleDECA TECHNOLOGIES INC·Filed 2016·Granted Nov 28, 2017·29 cites·20 claims
- 0397US9040316B1Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clippingDECA TECHNOLOGIES INC·Filed 2014·Granted May 26, 2015·40 cites·23 claims
- 0496US10720417B2Thermally enhanced fully molded fan-out moduleDECA TECHNOLOGIES INC·Filed 2018·Granted Jul 21, 2020·11 cites·20 claims
- 0596US10373902B2Fully molded miniaturized semiconductor moduleDECA TECHNOLOGIES INC·Filed 2017·Granted Aug 6, 2019·14 cites·20 claims
- 0696US9761571B2Thermally enhanced fully molded fan-out moduleDECA TECHNOLOGIES INC·Filed 2016·Granted Sep 12, 2017·13 cites·20 claims
- 0796US9177926B2Semiconductor device and method comprising thickened redistribution layersDECA TECHNOLOGIES INC·Filed 2015·Granted Nov 3, 2015·30 cites·20 claims
- 0895US8535978B2Die up fully molded fan-out wafer level packagingDECA TECHNOLOGIES INC·Filed 2012·Granted Sep 17, 2013·21 cites·27 claims
- 0994US11056453B2Stackable fully molded semiconductor structure with vertical interconnectsDECA TECHNOLOGIES INC·Filed 2020·Granted Jul 6, 2021·5 cites·19 claims
- 1094US9613912B2Method of marking a semiconductor packageDECA TECHNOLOGIES INC·Filed 2015·Granted Apr 4, 2017·9 cites·9 claims
- 1193US9196509B2Semiconductor device and method of adaptive patterning for panelized packagingDECA TECHNOLOGIES INC·Filed 2013·Granted Nov 24, 2015·16 cites·20 claims
- 1293US9159547B2Two step method of rapid curing a semiconductor polymer layerDECA TECHNOLOGIES INC·Filed 2013·Granted Oct 13, 2015·20 cites·9 claims
- 1392US9576919B2Semiconductor device and method comprising redistribution layersDECA TECHNOLOGIES INC·Filed 2015·Granted Feb 21, 2017·11 cites·17 claims
- 1492US8922021B2Die up fully molded fan-out wafer level packagingDECA TECHNOLOGIES INC·Filed 2013·Granted Dec 30, 2014·12 cites·28 claims
- 1590US9418905B2Adaptive patterning for panelized packagingDECA TECHNOLOGIES INC·Filed 2013·Granted Aug 16, 2016·8 cites·18 claims
- 1690US9337086B2Die up fully molded fan-out wafer level packagingDECA TECHNOLOGIES INC·Filed 2014·Granted May 10, 2016·10 cites·20 claims
- 1789US10818635B2Fully molded semiconductor package for power devices and method of making the sameDECA TECHNOLOGIES INC·Filed 2019·Granted Oct 27, 2020·5 cites·19 claims
- 1889US10050004B2Fully molded peripheral package on package deviceDECA TECHNOLOGIES INC·Filed 2016·Granted Aug 14, 2018·8 cites·20 claims
- 1988US9754835B2Semiconductor device and method comprising redistribution layersDECA TECHNOLOGIES INC·Filed 2016·Granted Sep 5, 2017·3 cites·19 claims
- 2088US8826221B2Adaptive patterning for panelized packagingDECA TECHNOLOGIES INC·Filed 2013·Granted Sep 2, 2014·7 cites·20 claims
- 2187US9269622B2Semiconductor device and method of land grid array packaging with bussing linesDECA TECHNOLOGIES INC·Filed 2013·Granted Feb 23, 2016·9 cites·20 claims
- 2286US9502397B13D interconnect component for fully molded packagesDECA TECHNOLOGIES INC·Filed 2016·Granted Nov 22, 2016·5 cites·20 claims
- 2385US9520331B2Adaptive patterning for panelized packagingDECA TECHNOLOGIES INC·Filed 2013·Granted Dec 13, 2016·5 cites·15 claims
- 2485US9397069B2Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clippingDECA TECHNOLOGIES INC·Filed 2015·Granted Jul 19, 2016·4 cites·20 claims
- 2584US8932443B2Adjustable wafer plating shield and methodDECA TECHNOLOGIES INC·Filed 2013·Granted Jan 13, 2015·9 cites·28 claims
- 2683US9978655B2Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clippingDECA TECHNOLOGIES INC·Filed 2016·Granted May 22, 2018·3 cites·20 claims
- 2783US9818659B2Multi-die package comprising unit specific alignment and unit specific routingDECA TECHNOLOGIES INC·Filed 2016·Granted Nov 14, 2017·4 cites·20 claims
- 2880US9464362B2Magnetically sealed wafer plating jig system and methodDECA TECHNOLOGIES INC·Filed 2012·Granted Oct 11, 2016·3 cites·33 claims
- 2980US8835230B2Fully molded fan-outDECA TECHNOLOGIES INC·Filed 2013·Granted Sep 16, 2014·3 cites·20 claims
- 3077US10373913B2Method of marking a semiconductor packageDECA TECHNOLOGIES INC·Filed 2017·Granted Aug 6, 2019·2 cites·17 claims
- 3177US10056304B2Automated optical inspection of unit specific patterningDECA TECHNOLOGIES INC·Filed 2017·Granted Aug 21, 2018·3 cites·20 claims
- 3277US9640495B2Semiconductor device processing method for material removalDECA TECHNOLOGIES INC·Filed 2016·Granted May 2, 2017·3 cites·20 claims
- 3372US9613830B2Fully molded peripheral package on package deviceDECA TECHNOLOGIES INC·Filed 2016·Granted Apr 4, 2017·2 cites·20 claims
- 3472US9401313B2Automated optical inspection of unit specific patterningDECA TECHNOLOGIES INC·Filed 2015·Granted Jul 26, 2016·2 cites·20 claims
- 3568US10373870B2Semiconductor device and method of packagingDECA TECHNOLOGIES INC·Filed 2018·Granted Aug 6, 2019·1 cites·20 claims
- 3667US10600652B2Semiconductor device processing method for material removalDECA TECHNOLOGIES INC·Filed 2017·Granted Mar 24, 2020·1 cites·20 claims
- 3767US10157803B2Semiconductor device and method of unit specific progressive alignmentDECA TECHNOLOGIES INC·Filed 2017·Granted Dec 18, 2018·1 cites·16 claims
- 3856US2017372964A1Semiconductor device and method comprising redistribution layersDECA TECHNOLOGIES INC·Filed 2017·Application pending·0 cites
- 3953US2014225271A1Panelized packaging with transferred dielectricDECA TECHNOLOGIES INC·Filed 2014·Application pending·0 cites
- 4053US2018012881A1Thermally enhanced fully molded fan-out moduleDECA TECHNOLOGIES INC·Filed 2017·Application pending·0 cites
- 4147US10672624B2Method of making fully molded peripheral package on package deviceDECA TECHNOLOGIES INC·Filed 2018·Granted Jun 2, 2020·0 cites·21 claims
- 4247US2011198762A1Panelized packaging with transferred dielectricDECA TECHNOLOGIES INC·Filed 2011·Application pending·0 cites
- 4344US2016336241A1Automated optical inspection of unit specific patterningDECA TECHNOLOGIES INC·Filed 2016·Application pending·0 cites
- 4442US10573601B2Semiconductor device and method of unit specific progressive alignmentDECA TECHNOLOGIES INC·Filed 2018·Granted Feb 25, 2020·0 cites·20 claims
- 4541US10204803B2Two step method of rapid curing a semiconductor polymer layerDECA TECHNOLOGIES INC·Filed 2015·Granted Feb 12, 2019·0 cites·25 claims
- 4637US9520364B2Front side package-level serialization for packages comprising unique identifiersDECA TECHNOLOGIES INC·Filed 2015·Granted Dec 13, 2016·0 cites·24 claims
- 4737US2017221830A1Fully molded peripheral package on package deviceDECA TECHNOLOGIES INC·Filed 2017·Application pending·0 cites
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