Inventor · disambiguated record
Hwa Sub Oh
Also filed as: OH HWA SUB
2 granted patents·2 pending applications·10 citations·filing 2010–2018
55Inventor score
Top patents by PatentIndex Score
4 records- 0186US10643919B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 5, 2020·7 cites·20 claims
- 0267US8399801B2Method of manufacturing printed circuit boardOH HWA-SUB·Filed 2010·Granted Mar 19, 2013·3 cites·5 claims
- 0345US2014174793A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0443US2013333927A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →