Printed circuit board and method of manufacturing the same

Abstract

Disclosed herein is a method of manufacturing a printed circuit board, the method including: preparing a base substrate having one surface and the other surface; forming first signal metal layers including a first signal via penetrating the base substrate from one surface to the other surface and first heat dissipation metal layers on the base substrate; and forming a build-up layer on the base substrate by forming second heat dissipation metal layers including second signal metal layers including second signal vias stacked on the first signal via and a heat dissipation via penetrating the base substrate and the build-up layer in the thickness direction.

What is claimed is: 
     
         1 . A method of manufacturing a printed circuit board, the method comprising:
 preparing a base substrate having one surface and the other surface;   forming on the base substrate first signal metal layers including a first signal via penetrating the base substrate from one surface to the other surface and first heat dissipation metal layers; and   forming on the base substrate a build-up layer by forming second heat dissipation metal layers including second signal metal layers including second signal vias stacked on the first signal via and a heat dissipation via penetrating the base substrate and the build-up layer in the thickness direction.   
     
     
         2 . The method as set forth in  claim 1 , wherein in the preparing of the base substrate, the base substrate is made of a copper-clad laminate. 
     
     
         3 . The method as set forth in  claim 1 , wherein in the forming of the first signal metal layers and the first heat dissipation metal layers, the first signal via has a sandglass shape. 
     
     
         4 . The method as set forth in  claim 1 , wherein the via hole for forming the first and second signal vias are formed through a laser drilling process. 
     
     
         5 . The method as set forth in  claim 1 , wherein in the forming of the first signal metal layers and the first heat dissipation metal layers, the via hole for forming the first signal via is formed through drilling from both one surface and the other surface of the base substrate. 
     
     
         6 . The method as set forth in  claim 1 , wherein the forming of the first signal metal layers and the first heat dissipation metal layers includes:
 forming a via hole for the first signal via penetrating the base substrate from one surface to the other surface; and   forming the first signal metal layers including the first signal via formed in the via hole for the first signal via, and the first heat dissipation metal layers.   
     
     
         7 . The method as set forth in  claim 1 , wherein the forming of the build-up layer includes:
 forming an isolation layer on the base substrate;   forming a metal layer on the isolation layer;   forming via holes for the second signal vias in the isolation layer and the metal layer, and forming a via hole for heat dissipation via penetrating the base substrate and the build-up layer in the thickness direction of the substrate; and   forming the build-up layer by forming the second signal metal layers including the second signal vias in the via holes for the second signal via hole and forming the second heat dissipation metal layers including the heat dissipation via in the via hole for the heat dissipation via.   
     
     
         8 . The method as set forth in  claim 7 , wherein the via hole for the heat dissipation via is formed through a mechanical drilling processing. 
     
     
         9 . The method as set forth in  claim 1 , further comprising forming a solder resist layer having an opening for exposing a pad formed on the build-up layer, after the forming of the build-up layer. 
     
     
         10 . A printed circuit board, comprising:
 a base substrate having one surface and the other surface, and including first signal metal layers including a first signal via penetrating the base substrate from one surface to the other surface and first heat dissipation metal layers;   a build-up layer being formed on the base substrate, and including second signal metal layers including second signal vias stacked on the first signal via and second heat dissipation metal layers facing the first heat dissipation metal layer; and   a heat dissipation via penetrating the base substrate and the build-up layer in the thickness direction of the substrate,   wherein the heat dissipation via penetrates the first heat dissipation metal layers in the thickness direction to reach the second heat dissipation metal layers.   
     
     
         11 . The printed circuit board as set forth in  claim 10 , wherein the base substrate is made of a copper-clad laminate. 
     
     
         12 . The printed circuit board as set forth in  claim 10 , wherein the first signal via has a sandglass shape. 
     
     
         13 . The printed circuit board as set forth in  claim 10 , wherein the build-up layer further includes an isolation layer including openings for the second signal vias and the heat dissipation via. 
     
     
         14 . The printed circuit board as set forth in  claim 10 , further comprising a solder resist layer having an opening for exposing a pad formed on the build-up layer.