Inventor · disambiguated record
Nobuhiro Imaizumi
Also filed as: IMAIZUMI NOBUHIRO
34 granted patents·7 pending applications·405 citations·filing 1993–2016
97Inventor score
Top patents by PatentIndex Score
41 records- 0188US5523633ACorrosion preventing circuit for switchYAZAKI CORP·Filed 1993·Granted Jun 4, 1996·55 cites·6 claims
- 0285US7514295B2Method for processing a base that includes connecting a first base to a second base with an insulating filmFUJITSU LTD·Filed 2005·Granted Apr 7, 2009·12 cites·10 claims
- 0384US9235001B2Optical device and optical moduleFUJITSU LTD·Filed 2015·Granted Jan 12, 2016·5 cites·7 claims
- 0482US6670264B2Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made therebyFUJITSU LTD·Filed 2002·Granted Dec 30, 2003·26 cites·36 claims
- 0579US8922027B2Electronic device having electrodes bonded with each otherFUJITSU LTD·Filed 2012·Granted Dec 30, 2014·4 cites·1 claims
- 0679US5895989APower supply unit and connector connection failure detection methodYAZAKI CORP·Filed 1997·Granted Apr 20, 1999·52 cites·7 claims
- 0776US5926010AOvercurrent breaking circuitYAZAKI CORP·Filed 1998·Granted Jul 20, 1999·42 cites·6 claims
- 0875US5845221ALoad control system for vehicleYAZAKI CORP·Filed 1996·Granted Dec 1, 1998·73 cites·4 claims
- 0973US10283434B2Electronic device, method for manufacturing the electronic device, and electronic apparatusFUJITSU LTD·Filed 2016·Granted May 7, 2019·2 cites·9 claims
- 1071US7816180B2Method for processing a base that includes connecting a first base to a second baseFUJITSU LTD·Filed 2009·Granted Oct 19, 2010·4 cites·17 claims
- 1168US7402461B2Method of connecting base materialsFUJITSU LTD·Filed 2004·Granted Jul 22, 2008·14 cites·12 claims
- 1267US6790881B2Adhesive compositionFUJITSU LTD·Filed 2002·Granted Sep 14, 2004·6 cites·15 claims
- 1365US7852439B2Multi-layer display element and manufacturing method for the sameFUJITSU LTD·Filed 2009·Granted Dec 14, 2010·2 cites·20 claims
- 1464US7811835B2Method for processing a base that includes connecting a first base to a second base with an insulating filmFUJITSU LTD·Filed 2009·Granted Oct 12, 2010·2 cites·7 claims
- 1561US5978352AMultiplex transmission systemYAZAKI CORP·Filed 1996·Granted Nov 2, 1999·28 cites·24 claims
- 1658US8492784B2Semiconductor device and method for producing the same, and power supplyOKAMOTO KEISHIRO·Filed 2011·Granted Jul 23, 2013·1 cites·20 claims
- 1757US5859845AVehicle load control systemYAZAKI CORP·Filed 1996·Granted Jan 12, 1999·24 cites·14 claims
- 1856US8674520B2Semiconductor device, method for manufacturing the same, and power supply unitIMAIZUMI NOBUHIRO·Filed 2012·Granted Mar 18, 2014·1 cites·19 claims
- 1955US9911642B2Method of manufacturing an electronic device, and electronic device manufacturing apparatusFUJITSU LTD·Filed 2014·Granted Mar 6, 2018·0 cites·8 claims
- 2055US9082756B2Semiconductor device and power source deviceFUJITSU LTD·Filed 2014·Granted Jul 14, 2015·0 cites·8 claims
- 2155US6522935B1Control-specification design management system used for load control devicesYAZAKI CORP·Filed 1996·Granted Feb 18, 2003·13 cites·6 claims
- 2253US8673762B2Solder, soldering method, and semiconductor deviceAKAMATSU TOSHIYA·Filed 2011·Granted Mar 18, 2014·1 cites·4 claims
- 2351US6873056B2Electrode-to-electrode bond structureFUJITSU LTD·Filed 2003·Granted Mar 29, 2005·3 cites·3 claims
- 2451US6576081B2Adhesive, bonding method and assembly of mounting substrateFUJITSU LTD·Filed 1999·Granted Jun 10, 2003·19 cites·12 claims
- 2549US10056342B2Electronic component and electronic deviceFUJITSU LTD·Filed 2012·Granted Aug 21, 2018·0 cites·8 claims
- 2647US10062658B2Electronic component and electronic deviceFUJITSU LTD·Filed 2015·Granted Aug 28, 2018·0 cites·11 claims
- 2747US9754904B2Electronic apparatus and method for manufacturing electronic apparatusFUJITSU LTD·Filed 2016·Granted Sep 5, 2017·0 cites·15 claims
- 2847US6869822B2Method of making a semiconductor device with adhesive sealing subjected to two-fold hardeningFUJITSU LTD·Filed 2002·Granted Mar 22, 2005·3 cites·13 claims
- 2942US9853014B2Electronic component, electronic apparatus, and method of manufacturing electronic apparatusFUJITSU LTD·Filed 2016·Granted Dec 26, 2017·0 cites·19 claims
- 3042US8728867B2Semiconductor device, manufacturing method of semiconductor device, and power source deviceSHIMIZU KOZO·Filed 2012·Granted May 20, 2014·0 cites·10 claims
- 3141US8409931B2Method of manufacturing semiconductor deviceSAKAI TAIJI·Filed 2012·Granted Apr 2, 2013·0 cites·13 claims
- 3240US2006027936A1Method for processing baseFUJITSU LTD·Filed 2004·Application pending·0 cites
- 3340US2005110169A1Semiconductor device and method of making the sameFUJITSU LTD·Filed 2004·Application pending·0 cites
- 3440US2012211762A1Semiconductor device, method of manufacturing semiconductor device and electronic circuitIMADA TADAHIRO·Filed 2011·Application pending·0 cites
- 3537US2012211764A1Semiconductor device and method for manufacturing semiconductor deviceOKAMOTO KEISHIRO·Filed 2012·Application pending·0 cites
- 3636US2016354871A1Flux and method for manufacturing semiconductor deviceFUJITSU LTD·Filed 2016·Application pending·0 cites
- 3736US2016228999A1Flux and method of manufacturing electronic deviceFUJITSU LTD·Filed 2015·Application pending·0 cites
- 3836US2012217626A1Semiconductor device and method for manufacturing semiconductor deviceSAKAI TAIJI·Filed 2012·Application pending·0 cites
- 3930US5943315AMultiplex transmission system and abnormality processing controlling method and apparatus used thereforYAZAKI CORP·Filed 1997·Granted Aug 24, 1999·10 cites·11 claims
- 4029US6009105AMultiplex communication system for vehicleYAZAKI CORP·Filed 1996·Granted Dec 28, 1999·3 cites·2 claims
- 4120US5768549AInput interface using multiplex type input circuitYAZAKI CORP·Filed 1996·Granted Jun 16, 1998·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →