Inventor · disambiguated record
Mohsen Salek
Also filed as: SALEK MOHSEN · SALEK MOHSEN S
18 granted patents·8 pending applications·640 citations·filing 1996–2016
96Inventor score
Top patents by PatentIndex Score
26 records- 0198US7925377B2Cluster tool architecture for processing a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Apr 12, 2011·45 cites·3 claims
- 0298US7743728B2Cluster tool architecture for processing a substrateAPPLIED MATERIALS INC·Filed 2008·Granted Jun 29, 2010·36 cites·16 claims
- 0398US7694647B2Cluster tool architecture for processing a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Apr 13, 2010·42 cites·19 claims
- 0498US7357842B2Cluster tool architecture for processing a substrateSOKUDO CO LTD·Filed 2005·Granted Apr 15, 2008·106 cites·11 claims
- 0596US8146530B2Cluster tool architecture for processing a substrateISHIKAWA TETSUYA·Filed 2008·Granted Apr 3, 2012·22 cites·8 claims
- 0695US8550031B2Cluster tool architecture for processing a substrateISHIKAWA TETSUYA·Filed 2012·Granted Oct 8, 2013·13 cites·10 claims
- 0795US7819079B2Cartesian cluster tool configuration for lithography type processesAPPLIED MATERIALS INC·Filed 2006·Granted Oct 26, 2010·26 cites·11 claims
- 0894US8215262B2Cluster tool architecture for processing a substrateISHIKAWA TETSUYA·Filed 2008·Granted Jul 10, 2012·15 cites·9 claims
- 0994US8181596B2Cluster tool architecture for processing a substrateISHIKAWA TETSUYA·Filed 2008·Granted May 22, 2012·15 cites·20 claims
- 1089US6390904B1Retainers and non-abrasive liners used in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 1998·Granted May 21, 2002·103 cites·25 claims
- 1188US5861066AMethod and apparatus for cleaning edges of contaminated substratesONTRAK SYSTEMS INC·Filed 1996·Granted Jan 19, 1999·88 cites·18 claims
- 1287US6913518B2Profile control platenAPPLIED MATERIALS INC·Filed 2003·Granted Jul 5, 2005·25 cites·15 claims
- 1385US10515834B2Multi-station tool with wafer transfer microclimate systemsLAM RES CORP·Filed 2016·Granted Dec 24, 2019·4 cites·17 claims
- 1484US6334229B1Apparatus for cleaning edges of contaminated substratesLAM RES CORP·Filed 1999·Granted Jan 1, 2002·63 cites·31 claims
- 1574US6709218B1Robot blade for semiconductor processing equipmentAPPLIED MATERIALS INC·Filed 1999·Granted Mar 23, 2004·36 cites·23 claims
- 1660US8580615B2Method and system for wafer level singulationSCHUEGRAF KLAUS·Filed 2012·Granted Nov 12, 2013·1 cites·9 claims
- 1760US2012180983A1Cluster tool architecture for processing a substrateISHIKAWA TETSUYA·Filed 2012·Application pending·0 cites
- 1860US2008223293A1Cluster tool architecture for processing a substrateSOKUDO CO LTD·Filed 2008·Application pending·0 cites
- 1954US9502294B2Method and system for wafer level singulationAPPLIED MATERIALS INC·Filed 2013·Granted Nov 22, 2016·0 cites·10 claims
- 2048US7115024B2Profile control platenAPPLIED MATERIALS INC·Filed 2005·Granted Oct 3, 2006·0 cites·17 claims
- 2146US2009110532A1Method and apparatus for providing wafer centering on a track lithography toolSOKUDO CO LTD·Filed 2007·Application pending·0 cites
- 2245US2009023297A1Method and apparatus for hmds treatment of substrate edgesSOKUDO CO LTD·Filed 2007·Application pending·0 cites
- 2344US2008050679A1Methods and systems for performing immersion processing during lithographySOKUDO CO LTD·Filed 2007·Application pending·0 cites
- 2436US2003070695A1N2 splash guard for liquid injection on the rotating substrateAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
- 2536US2017092516A1Modular system layout utilizing three-dimensionsLAM RES CORP·Filed 2016·Application pending·0 cites
- 2635US2017040205A1High-hardness-material-powder infused elastomer for high friction and compliance for silicon wafer transferLAM RES CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →