Inventor · disambiguated record
Akinori Shiraishi
Also filed as: SHIRAISHI AKINORI
66 granted patents·14 pending applications·367 citations·filing 2004–2014
98Inventor score
Top patents by PatentIndex Score
80 records- 0196US7656023B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 2, 2010·37 cites·4 claims
- 0293US7795140B2Method of manufacturing substrateSHINKO ELECTRIC IND CO·Filed 2008·Granted Sep 14, 2010·28 cites·12 claims
- 0393US7508057B2Electronic component deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Mar 24, 2009·26 cites·10 claims
- 0490US7884632B2Semiconductor inspecting deviceSHINKO ELECTRIC ELECTRIC IND CO LTD·Filed 2009·Granted Feb 8, 2011·29 cites·5 claims
- 0590US7524753B2Semiconductor device having through electrode and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Apr 28, 2009·20 cites·12 claims
- 0689US7825423B2Semiconductor device and method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 2, 2010·17 cites·12 claims
- 0789US7750358B2Semiconductor device and manufacturing method of semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Jul 6, 2010·15 cites·19 claims
- 0887US7838897B2Light-emitting device and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 23, 2010·14 cites·6 claims
- 0984US9052341B2Probe card and manufacturing method thereofSHIRAISHI AKINORI·Filed 2012·Granted Jun 9, 2015·6 cites·10 claims
- 1084US7488094B2Semiconductor device and manufacturing method of semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 10, 2009·12 cites·11 claims
- 1183US8314344B2Wiring board and manufacturing method of the sameSAKAGUCHI HIDEAKI·Filed 2009·Granted Nov 20, 2012·11 cites·9 claims
- 1283US7981798B2Method of manufacturing substrateSHINKO ELECTRIC IND CO·Filed 2008·Granted Jul 19, 2011·12 cites·5 claims
- 1383US7494898B2Method for manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 24, 2009·11 cites·6 claims
- 1481US8611389B2Light emitting device and package componentSHIRAISHI AKINORI·Filed 2011·Granted Dec 17, 2013·5 cites·8 claims
- 1581US7633150B2Semiconductor device and method for manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Dec 15, 2009·7 cites·6 claims
- 1680US8368206B2Heat radiation package and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2008·Granted Feb 5, 2013·8 cites·14 claims
- 1779US8922234B2Probe card and method for manufacturing probe cardSHINKO ELECTRIC IND CO·Filed 2013·Granted Dec 30, 2014·3 cites·4 claims
- 1879US7948092B2Electronic component and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted May 24, 2011·8 cites·13 claims
- 1978US8148738B2Semiconductor device having an element mounted on a substrate and an electrical component connected to the elementMURAYAMA KEI·Filed 2007·Granted Apr 3, 2012·8 cites·12 claims
- 2078US7894201B2Electronic component and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Feb 22, 2011·9 cites·3 claims
- 2178US7829993B2Semiconductor apparatusSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 9, 2010·6 cites·5 claims
- 2276US7850344B2Light emitting device housing and a manufacturing method thereof, and light emitting apparatus using the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Dec 14, 2010·7 cites·9 claims
- 2375US7777349B2Semiconductor apparatus having side surface wiringSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 17, 2010·6 cites·5 claims
- 2474US7794112B2Lighting apparatusSHINKO ELECTRIC IND CO·Filed 2007·Granted Sep 14, 2010·5 cites·7 claims
- 2573US8100555B2Lighting apparatusHIGASHII MITSUTOSHI·Filed 2010·Granted Jan 24, 2012·5 cites·4 claims
- 2673US7834438B2Sealed structure and method of fabricating sealed structure and semiconductor device and method of fabricating semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 16, 2010·5 cites·8 claims
- 2773US7655956B2Semiconductor device and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 2, 2010·5 cites·10 claims
- 2871US9099615B2Light emitting device that includes wavelength conversion layer having outer peripheral portion having convex projecting part with light reflection layer formed thereonTSUTSUMI YASUAKI·Filed 2012·Granted Aug 4, 2015·3 cites·9 claims
- 2971US8178957B2Electronic component device, and method of manufacturing the sameTAGUCHI YUICHI·Filed 2010·Granted May 15, 2012·3 cites·10 claims
- 3070US8053886B2Semiconductor package and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2009·Granted Nov 8, 2011·4 cites·16 claims
- 3168US7622317B2Light emitting diode and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Nov 24, 2009·3 cites·5 claims
- 3264US7989927B2Silicon substrate for packageSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 2, 2011·2 cites·6 claims
- 3364US7705451B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Apr 27, 2010·1 cites·9 claims
- 3463US8532457B2Method of manufacturing optical waveguide, optical waveguide and optical transmission deviceSHIRAISHI AKINORI·Filed 2010·Granted Sep 10, 2013·1 cites·4 claims
- 3563US8017443B2Light transmissive cover, device provided with same and methods for manufacturing themSHINKO ELECTRIC IND CO·Filed 2006·Granted Sep 13, 2011·2 cites·5 claims
- 3663US7960820B2Semiconductor packageSHINKO ELECTRIC IND CO·Filed 2008·Granted Jun 14, 2011·2 cites·13 claims
- 3763US7622747B2Light emitting device and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2006·Granted Nov 24, 2009·2 cites·2 claims
- 3862US8044429B2Light-emitting device and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2010·Granted Oct 25, 2011·1 cites·4 claims
- 3962US7876036B2Light emitting apparatus and manufacturing method thereforSHINKO ELECTRIC IND CO·Filed 2006·Granted Jan 25, 2011·2 cites·4 claims
- 4061US8394678B2Semiconductor chip stacked body and method of manufacturing the sameMURAYAMA KEI·Filed 2009·Granted Mar 12, 2013·2 cites·21 claims
- 4161US7888953B2Probe cardSHINKO ELECTRIC IND CO·Filed 2009·Granted Feb 15, 2011·3 cites·6 claims
- 4260US8922232B2Test-use individual substrate, probe, and semiconductor wafer testing apparatusMATSUMURA SHIGERU·Filed 2011·Granted Dec 30, 2014·2 cites·12 claims
- 4359US8481863B2Substrate and method for manufacturing the sameSHIRAISHI AKINORI·Filed 2008·Granted Jul 9, 2013·2 cites·12 claims
- 4458US8304862B2Semiconductor package and manufacturing method of the sameTAGUCHI YUICHI·Filed 2009·Granted Nov 6, 2012·1 cites·13 claims
- 4558US7708613B2Method of producing light emitting apparatusSHINKO ELECTRIC IND CO·Filed 2007·Granted May 4, 2010·1 cites·4 claims
- 4656US2013000955A1Wiring board and manufacturing method of the sameSHINKO ELECTRIC IND CO·Filed 2012·Application pending·0 cites
- 4753US2010001304A1Light emitting diode and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Application pending·0 cites
- 4853US2011260744A1Probe card and method for manufacturing probe cardSHINKO ELECTRIC IND CO·Filed 2011·Application pending·0 cites
- 4952US9523716B2Probe guide plate and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2014·Granted Dec 20, 2016·0 cites·11 claims
- 5052US7470891B2Optical deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Dec 30, 2008·0 cites·8 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
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