Wiring board and manufacturing method of the same

Abstract

A wiring board includes a main body, a piercing electrode piercing the main body, a first wiring pattern provided at a first surface side of the main body, the first wiring pattern having a pad being electrically connected to one end of the piercing electrode and being where an electronic component is mounted, and a second wiring pattern provided at a second surface side of the main body, the second surface side being situated at a side opposite to the first surface side, the second wiring pattern having an external connection pad being electrically connected to another end of the piercing electrode. A recess and a resin covering the recess are provided at an external circumferential part of the wiring board to surround the first and second wiring patterns and the piercing electrode, the recess piercing the main body of a part positioned at the external circumferential part.

1 . A wiring board, comprising:
 a substrate main body;   a piercing electrode configured to pierce the substrate main body;   a first wiring pattern provided at a first surface side of the substrate main body, the first wiring pattern having a pad, the pad being electrically connected to one end part of the piercing electrode, the pad being where an electronic component is mounted; and   a second wiring pattern provided at a second surface side of the substrate main body, the second surface side being situated at a side opposite to the first surface side, the second wiring pattern having an external connection pad, the external connection pad being electrically connected to another end part of the piercing electrode,   wherein a recess part and a resin configured to cover the recess part are provided at an external circumferential part of the wiring board so as to surround the first wiring pattern, the second wiring pattern, and the piercing electrode, the recess part being configured to pierce the substrate main body of a part positioned at the external circumferential part of the wiring board.   
     
     
         2 . The wiring board as claimed in  claim 1 , further comprising:
 a first insulation resin layer provided on a first surface of the substrate main body, the first insulation resin layer being configured to cover the first wiring pattern except for the pad, and   a second insulation resin layer provided on a second surface of the substrate main body, the second insulation resin layer being configured to cover the second wiring pattern except for the external connection pad,   wherein the recess part is provided in the substrate main body, the first insulation resin layer, and the second insulation resin layer,   wherein the resin is configured to cover a side surface of the substrate main body, a side surface of the first insulation resin layer, and a side surface of the second insulation resin layer that are exposed at the recess part.   
     
     
         3 . The wiring board as claimed in  claim 1 , wherein the resin projects from an upper surface of the first insulation resin layer and a lower surface of the second insulation resin layer. 
     
     
         4 . The wiring board as claimed in  claim 1 , wherein the resin is formed of epoxy resin, polyimide resin, or silicone resin. 
     
     
         5 . The wiring board as claimed in  claim 1 , wherein the substrate main body is formed of a silicon substrate or a glass substrate. 
     
     
         6 . The wiring board as claimed in  claim 1 , wherein the first and the second insulation resin layers are solder resist layers. 
     
     
         7 . A manufacturing method of a wiring board, comprising:
 a substrate main body preparing step of preparing a substrate main body, the substrate main body having a plurality of wiring board forming areas and a plurality of cutting areas, the cutting areas being provided so as to surround the plural wiring board forming areas;   a piercing electrode and wiring pattern forming step of forming a piercing electrode, a first wiring pattern, and a second wiring pattern in the plural wiring board forming areas, the piercing electrode being configured to pierce the substrate main body, the first wiring pattern having a pad, the pad being electrically connected to one end part of the piercing electrode, the pad being where an electronic component is mounted, the second wiring pattern having an external connection pad, the external connection pad being electrically connected to another end part of the piercing electrode;   an insulation resin layer forming step of forming a first insulation resin layer and a second insulation resin layer, the first insulation resin layer having an opening part where the pad is exposed, the first insulation resin layer being configured to cover a part of the first wiring pattern excluding the pad, the second insulation resin layer having an opening part where the external connection pad is exposed, the second insulation resin layer being configured to cover a part of the second wiring pattern excluding the external connection pad;   a first groove part forming step of forming, after the insulation resin layer forming step, a first groove part in the first insulation resin layer and the substrate main body of the cutting area and portions of the plural wiring forming areas neighboring the cutting areas, the first groove part having a width greater than a width of the cutting area;   a first resin forming step of forming a first resin filling the first groove part; and   a cutting step of cutting a part corresponding to the cutting area of the substrate main body, the second insulation resin layer, and the first resin filling in the first groove, so that pieces of the plural wiring boards formed in the plural wiring forming areas are made, and thereby a first recess part and the first resin configured to cover the first recess part are formed at a corner part of the wiring board positioned at a side where the first insulation resin layer is formed so as to surround the first wiring pattern, the first recess part being configured to notch a first corner part of the substrate main body.   
     
     
         8 . The manufacturing method of the wiring board as claimed in  claim 7 , further comprising:
 a second groove part forming step of forming, between the first resin forming step and the cutting step, a second groove part in the second insulation resin layer and the substrate main body of the cutting area and portions of the plural wiring forming areas neighboring the cutting areas, the second groove part having a width greater than a width of the cutting area; and   a second resin forming step of forming a second resin filling the second groove part;   wherein, in the cutting step, a part corresponding to the cutting area of the substrate main body, the first resin and the second resin are cut, so that a second recess part is formed at a corner part of the wiring board positioned at a side where the second insulation resin layer is formed so as to surround the second wiring pattern, the second recess part being covered with the second resin, the second recess part being configured to notch a second corner part of the substrate main body.   
     
     
         9 . The manufacturing method of the wiring board as claimed in  claim 8 ,
 wherein the second groove part is formed in the second groove part forming step so that the second groove part is connected to the first groove part.   
     
     
         10 . A manufacturing method of a wiring board, comprising:
 a substrate main body preparing step of preparing a substrate main body, the substrate main body having a plurality of wiring board forming areas and a plurality of cutting areas, the cutting areas being provided so as to surround the plural wiring board forming areas;   a piercing electrode and wiring pattern forming step of forming a piercing electrode, a first wiring pattern, and a second wiring pattern in the plural wiring board forming areas, the piercing electrode being configured to pierce the substrate main body, the first wiring pattern having a pad, the pad being electrically connected to one end part of the piercing electrode, the pad being where an electronic component is mounted, the second wiring pattern having an outside connection pad, the outside connection pad being electrically connected to another end part of the piercing electrode;   an insulation resin layer forming step of forming a first insulation resin layer and a second insulation resin layer, the first insulation resin layer having an opening part where the pad is exposed, the first insulation resin layer being configured to cover a part of the first wiring pattern excluding the pad, the second insulation resin layer having an opening part where the outside connection pad is exposed, the second insulation resin layer being configured to cover a part of the second wiring pattern excluding the outside connection pad;   a piercing groove part forming step of forming, after the insulation resin layer forming step, a piercing groove part in the first insulation resin layer, the second wiring pattern, and the substrate main body of the cutting area and portions of the plural wiring forming areas neighboring the cutting areas, the piercing groove part having a width greater than a width of the cutting area;   a resin forming step of forming a resin filling the piercing groove part; and   a cutting step of cutting a part corresponding to the cutting area of the resin, so that pieces of the plural wiring boards are made, and thereby a recess part is formed at the external circumferential part of the wiring board so as to surround the first and the second wiring patterns and the piercing electrode, the recess part being covered with the resin.