Probe card and method for manufacturing probe card

Abstract

A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body.

1 . A probe card for electrically connecting to an electrode pad formed on a test subject to conduct an electrical test on the test subject, the probe card comprising:
 a substrate body including a first surface, which is located to face toward the test subject, and a second surface, which is opposite to the first surface;   a through electrode extending through the substrate body between the first surface and the second surface;   a contact bump formed in correspondence with the electrode pad and electrically connected to the through electrode; and   an elastic body filled in an accommodating portion formed, in the substrate body, extending from the first surface toward the second surface, wherein the contact bump is formed on the elastic body.   
     
     
         2 . The probe card according to  claim 1 , wherein the accommodating portion is a through hole extending through the substrate body between the first surface and the second surface. 
     
     
         3 . The probe card according to  claim 1 , further comprising a support body arranged, in the elastic body, extending from the first surface toward the second surface of the substrate body, wherein the contact bump is connected to the support body. 
     
     
         4 . The probe card according to  claim 3 , wherein the support body extends through the elastic body and serves as the through electrode. 
     
     
         5 . The probe card according to  claim 3 , wherein the support body is conductive, and the contact bump is directly connected to the conductive support body. 
     
     
         6 . The probe card according to  claim 3 , wherein the support body includes a second through electrode that extends through the elastic body. 
     
     
         7 . The probe card according to  claim 3 , wherein the support body is movable in the elastic body. 
     
     
         8 . The probe card according to  claim 7 , wherein the support body is formed using part of the substrate body. 
     
     
         9 . The probe card according to  claim 3 , wherein the contact bump is connected to the support body via a wire arranged on the first surface of the substrate body. 
     
     
         10 . The probe card according to  claim 9 , wherein the elastic body is exposed from the first surface of the substrate body, and the wire is arranged along the elastic body. 
     
     
         11 . The probe card according to  claim 9 , wherein the wire includes a bent portion that absorbs expansion and contraction of the elastic body. 
     
     
         12 . The probe card according to  claim 1 , wherein
 the contact bump is one of a plurality of contact bumps arranged in correspondence with a plurality of electrode pads of the test subject; and   two or more of the plurality of contact bumps are arranged on the elastic body.   
     
     
         13 . The probe card according to  claim 1 , wherein
 the contact bump is one of a plurality of contact bumps arranged in correspondence with a plurality of electrode pads of the test subject; and   the elastic body is arranged on each of the plurality of contact bumps.   
     
     
         14 . The probe card according to  claim 1 , wherein the probe card electrically connects the electrode pad of the test subject to a wiring substrate with the through electrode, and the probe card further comprises:
 a connection bump arranged on the second surface of the substrate body, wherein the connection bump is electrically connected to a second electrode pad formed on the wiring substrate, and the connection bump has a height that is set in correspondence with movement of the contact bump.   
     
     
         15 . A method for manufacturing a probe card for electrically connecting to an electrode pad formed on a test subject to conduct an electrical test on the test subject, the method comprising:
 forming a first deep hole and a second deep hole in a substrate;   filling the first deep hole with an elastic body;   forming a substrate body by reducing thickness of the substrate so that the first and second deep holes respectively become first and second through holes;   forming a through electrode in the second through hole; and   forming a contact bump corresponding to the electrode pad on the elastic body.   
     
     
         16 . The method according to  claim 15 , further comprising:
 forming a wire along the elastic body before forming the contact bump, wherein the wire is electrically connected to the through electrode, and the contact bump is formed on the elastic body via the wire arranged in between.   
     
     
         17 . The method according to  claim 15 , further comprising:
 forming the first deep hole to include a cylindrical portion extending from a bottom of the first deep hole toward an opening of the first deep hole;   reducing the thickness of the substrate to separate the cylindrical portion from the substrate so that the cylindrical portion serves as a support body; and   forming the contact bump on the support body.   
     
     
         18 . The method according to  claim 17 , further comprising:
 forming a wire along the elastic body before forming the contact bump, wherein the wire is electrically connected to the through electrode, and the contact bump is formed on the support body via the wire arranged in between.   
     
     
         19 . A method for manufacturing a probe card for electrically connecting to an electrode pad formed on a test subject to conduct an electrical test on the test subject, the method comprising:
 forming a first deep hole in a substrate;   filling the first deep hole with an elastic body;   forming a substrate body by reducing thickness of the substrate so that the first deep hole becomes a first through hole;   forming a second through hole in the elastic body;   forming a through electrode in the second through hole; and   forming a contact bump connected to the through electrode.   
     
     
         20 . The method according to  claim 19 , further comprising:
 forming a second deep hole in the substrate together with the first deep hole;   forming a first through hole from the first deep hole and a third through hole from the second deep hole when reducing the thickness of the substrate to form the substrate body;   forming a second through electrode in the third through hole; and   forming a wire along the elastic body before forming the contact bump, wherein the wire is electrically connected to the second through electrode, and the contact bump is formed on the through electrode, which is formed in the second through hole of the elastic body, via the wire arranged in between.