Inventor · disambiguated record
Cheng Sim Kee
Also filed as: KEE CHENG SIM
4 granted patents·3 pending applications·4 citations·filing 2005–2013
64Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0161US7674653B2Die offset die to bondingSPANSION LLC·Filed 2008·Granted Mar 9, 2010·2 cites·3 claims
- 0249US7750481B2Die offset die to die bondingSPANSION LLC·Filed 2008·Granted Jul 6, 2010·0 cites·5 claims
- 0346US7554204B2Die offset die to die bondingSPANSION LLC·Filed 2007·Granted Jun 30, 2009·0 cites·8 claims
- 0443US8586413B2Multi-chip module having a support structure and method of manufactureFOONG YIN LYE·Filed 2005·Granted Nov 19, 2013·2 cites·19 claims
- 0537US2009051043A1Die stacking in multi-die stacks using die support mechanismsSPANSION LLC·Filed 2007·Application pending·0 cites
- 0637US2014061895A1Multi-Chip Module and Method of ManufactureSPANSION LLC·Filed 2013·Application pending·0 cites
- 0734US2009001599A1Die attachment, die stacking, and wire embedding using filmSPANSION LLC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →