Multi-Chip Module and Method of Manufacture

Abstract

A multi-chip module and a method for manufacturing the multi-chip module that mitigates wire breakage. A first semiconductor chip is mounted and wirebonded to a support substrate. A spacer is coupled to the first semiconductor chip. A support material is disposed on the spacer and a second semiconductor chip is positioned on the support material. The second semiconductor chip is pressed into the support material squeezing it into a region adjacent the spacer and between the first and second semiconductor chips. Alternatively, the support material is disposed on the first semiconductor chip and a die attach material is disposed on the spacer. The second semiconductor chip is pressed into the die attach material and the support material, squeezing a portion of the support material over the spacer edges. Wirebonds are formed between the support substrate and the first and second semiconductor chips.

What is claimed is: 
     
         1 . A multi-chip module, comprising:
 a support substrate having a chip receiving area and a plurality of substrate bonding pads;   a first semiconductor chip having a first plurality of chip bonding pads, the first semiconductor chip mounted to the chip receiving area;   a spacer having first and second opposing edges, the spacer coupled to the first semiconductor chip;   a support material in contact with the spacer; and   a second semiconductor chip having a second plurality of chip bonding pads, and coupled to the spacer using a die attach material, wherein a portion of the support material is positioned between, and in contact with, the first semiconductor chip and the second semiconductor chip.   
     
     
         2 . The multi-chip module of  claim 1 , wherein the support material substantially fills the region between the first and second semiconductor chips. 
     
     
         3 . The multi-chip module of  claim 1 , wherein the support material is disposed on the spacer. 
     
     
         4 . The multi-chip module of  claim 1 , wherein the die attach material comprises at least one of silver filled epoxy, silica filled epoxy blend, or an epoxy film filled with an organic material. 
     
     
         5 . The multi-chip module of  claim 1 , wherein the spacer comprises dielectric material or a semiconductor material. 
     
     
         6 . The multi-chip module of  claim 5 , wherein the semiconductor material is silicon or a third semiconductor chip. 
     
     
         7 . The multi-chip module of  claim 1 , wherein the spacer has a square shape, a rectangular shape, a round shape, or a triangular shape. 
     
     
         8 . The multi-chip module of  claim 1 , wherein the support substrate is a ball grid array (BOA) substrate. 
     
     
         9 . The multi-chip module of  claim 1 , wherein the support substrate is one of a pin grid array (PGA) substrate, a ceramic substrate, or a printed circuit board, 
     
     
         10 . The multi-chip module of  claim 1 , wherein the support material is a thermal conductor and an electric insulator. 
     
     
         11 . The multi-chip module of  claim 1 , wherein the support material is an epoxy paste. 
     
     
         12 . The multi-chip module of  claim 11 , wherein the epoxy paste comprises an epoxy material filled with polytetrafluoroethylene, a nonconductive paste filled with an inorganic material, or a bismaleimide material filled with polytetrafluoroethylene. 
     
     
         13 . The multi-chip module of  claim 12 , wherein the nonconductive paste includes silica. 
     
     
         14 . The multi-chip module of  claim 1 , wherein the support material has a pre-cured shape of a double-Y shape, a dogbone shape, a circular shape, a triangular shape, a quadrilateral shape, a pentagonal shape, or another polygonal shape. 
     
     
         15 . The multi-chip module of  claim 1 , further comprising:
 a first set of interconnect wires formed to electrically connect one or more of the first plurality of chip bonding pads to a first portion of the plurality of substrate bonding pads, and   a second set of interconnect wires formed to electrically connect one or more of the second plurality of chip bonding pads to a second portion of the plurality of substrate bonding pads.   
     
     
         16 . The multi-chip module of  claim 15 , further comprising:
 a protective covering formed over the second semiconductor chip, the first semiconductor chip, the support substrate, the first set of interconnect wires and the second interconnect wires.   
     
     
         17 . The multi-chip module of  claim 16 , wherein the protective covering includes a lid secured to the support substrate using a lid attach material. 
     
     
         18 . The multichip module of  claim 1 , wherein the support substrate comprises a resin. 
     
     
         19 . The multi-chip module of  claim 18 , wherein the resin comprises one of an epoxy resin, a polyimide resin, a triazine resin, a phenolic resin or a bismaleimidetriazine (BT) resin. 
     
     
         20 . The multi-chip module of  claim 1 , wherein the support substrate comprises an epoxy-glass composite, FR-4, or a ceramic.