Inventor · disambiguated record
Bor-Jen Wu
Also filed as: WU BOR-JEN
14 granted patents·20 pending applications·542 citations·filing 1995–2021
93Inventor score
Files withWU BOR JEN11UNI LIGHT TECHNOLOGY INC9UNIT LIGHT TECHNOLOGY INC3WANG YU YEN2MINNESOTA MINING & MFG1
Top patents by PatentIndex Score
34 records- 0194US6468824B2Method for forming a semiconductor device having a metallic substrateUNI LIGHT TECHNOLOGY INC·Filed 2001·Granted Oct 22, 2002·177 cites·28 claims
- 0293US6555405B2Method for forming a semiconductor device having a metal substrateUNI LIGHT TECHNOLOGY INC·Filed 2001·Granted Apr 29, 2003·130 cites·15 claims
- 0388US6445007B1Light emitting diodes with spreading and improving light emitting areaUNI LIGHT TECHNOLOGY INC·Filed 2001·Granted Sep 3, 2002·90 cites·47 claims
- 0485US6884646B1Method for forming an LED device with a metallic substrateUNI LIGHT TECHNOLOGY INC·Filed 2004·Granted Apr 26, 2005·67 cites·20 claims
- 0578US8702270B2Tube type LED lighting assemblyWU BOR-JEN·Filed 2012·Granted Apr 22, 2014·4 cites·8 claims
- 0678US8523388B2Planar LED lighting apparatusWU BOR-JEN·Filed 2012·Granted Sep 3, 2013·7 cites·4 claims
- 0775US6608328B2Semiconductor light emitting diode on a misoriented substrateUNI LIGHT TECHNOLOGY INC·Filed 2001·Granted Aug 19, 2003·36 cites·28 claims
- 0871US7364926B2Method for manufacturing gallium nitride light emitting diode devicesUNI LIGHT TECHNOLOGY INC·Filed 2006·Granted Apr 29, 2008·6 cites·20 claims
- 0963US10903267B2System and method for making micro LED displayWU BOR JEN·Filed 2019·Granted Jan 26, 2021·1 cites·18 claims
- 1059US7341882B2Method for forming an opto-electronic deviceUNI LIGHT TECHNOLOGY INC·Filed 2003·Granted Mar 11, 2008·6 cites·28 claims
- 1156US2021278198A1Optical Measurement SystemWANG YU YEN·Filed 2021·Application pending·0 cites
- 1254US11041711B2Optical measurement systemWANG YU YEN·Filed 2019·Granted Jun 22, 2021·0 cites·9 claims
- 1351US2021134878A1System and Method for Making Micro LED DisplayWU BOR JEN·Filed 2020·Application pending·0 cites
- 1449US5879962AIII-V/II-VI Semiconductor interface fabrication methodMINNESOTA MINING & MFG·Filed 1995·Granted Mar 9, 1999·17 cites·28 claims
- 1549US2009140282A1Led structure for flip-chip package and method thereofUNIT LIGHT TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 1649US2022378971A1UVC LED Disinfecting DeviceWU BOR JEN·Filed 2021·Application pending·0 cites
- 1748US7368369B2Method for activating P-type semiconductor layerUNI LIGHT TECHNOLOGY INC·Filed 2005·Granted May 6, 2008·0 cites·22 claims
- 1844US2013182430A1Planar LED Lighting ApparatusWU BOR-JEN·Filed 2012·Application pending·0 cites
- 1944US2006284321A1LED structure for flip-chip package and method thereofUNIT LIGHT TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 2043US6963167B2Electrode structure for a light-emitting elementUNI LIGHT TECHNOLOGY INC·Filed 2003·Granted Nov 8, 2005·1 cites·12 claims
- 2143US2022378973A1UVC LED Disinfecting DeviceWU BOR JEN·Filed 2021·Application pending·0 cites
- 2243US2013181243A1Solid State Lighting DeviceWU BOR-JEN·Filed 2012·Application pending·0 cites
- 2341US2014362586A1Led light bulbNAN YA PHOTONICS INC·Filed 2013·Application pending·0 cites
- 2440US2005127388A1Light-emitting device and forming method thereofFiled 2004·Application pending·0 cites
- 2539US2005127374A1Light-emitting device and forming method thereofFiled 2003·Application pending·0 cites
- 2639US2004175904A1Method for activating P-type semiconductor layerFiled 2003·Application pending·0 cites
- 2739US2021013367A1System and Method for Making Micro LED DisplayWU BOR JEN·Filed 2020·Application pending·0 cites
- 2838US2005230699A1Light-emitting device with improved optical efficiencyWU BOR-JEN·Filed 2005·Application pending·0 cites
- 2937US2003132442A1Semiconductor device with an ohmic ontact and method of manufacturing the sameFiled 2003·Application pending·0 cites
- 3037US2006286694A1Method for fabricating LEDUNIT LIGHT TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 3136US2003015794A1Semiconductor device with an ohmic contact and method of manufacturing the sameFiled 2002·Application pending·0 cites
- 3236US2004173808A1Flip-chip like light emitting device packageFiled 2003·Application pending·0 cites
- 3333US2005227394A1Method for forming die protecting layerWU BOR-JEN·Filed 2004·Application pending·0 cites
- 3428US2002104997A1Semiconductor light emitting diode on a misoriented substrateFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Bor-Jen Wu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →