Inventor · disambiguated record
Yasumitsu Orii
Also filed as: ORII YASUMITSU · ORII YASUMITSU K
17 granted patents·3 pending applications·69 citations·filing 1996–2018
91Inventor score
Files withIBM20
Top patents by PatentIndex Score
20 records- 0185US10797011B2Method of forming solder bumpsIBM·Filed 2017·Granted Oct 6, 2020·3 cites·18 claims
- 0281US7674651B2Mounting method for semiconductor parts on circuit substrateIBM·Filed 2007·Granted Mar 9, 2010·13 cites·1 claims
- 0380US10115692B2Method of forming solder bumpsIBM·Filed 2016·Granted Oct 30, 2018·2 cites·17 claims
- 0475US9586281B2Forming a solder joint between metal layersIBM·Filed 2015·Granted Mar 7, 2017·2 cites·12 claims
- 0574US9698119B2Interfacial alloy layer for improving electromigration (EM) resistance in solder jointsIBM·Filed 2016·Granted Jul 4, 2017·2 cites·8 claims
- 0669US9391034B2Interfacial alloy layer for improving electromigration (EM) resistance in solder jointsIBM·Filed 2013·Granted Jul 12, 2016·2 cites·6 claims
- 0769US5878942ASoldering method and soldering apparatusIBM·Filed 1996·Granted Mar 9, 1999·40 cites·13 claims
- 0864US9466533B2Semiconductor structure including a through electrode, and method for forming the sameIBM·Filed 2015·Granted Oct 11, 2016·1 cites·5 claims
- 0961US10833035B2Method of forming solder bumpsIBM·Filed 2018·Granted Nov 10, 2020·0 cites·20 claims
- 1061US7605075B2Multilayer circuit board and method of manufacturing the sameIBM·Filed 2005·Granted Oct 20, 2009·4 cites·9 claims
- 1158US10840202B2Method of forming solder bumpsIBM·Filed 2017·Granted Nov 17, 2020·0 cites·20 claims
- 1254US2015249064A1Prevention of warping during handling of chip-on-waferIBM·Filed 2014·Application pending·0 cites
- 1352US10252363B2Forming a solder joint between metal layersIBM·Filed 2017·Granted Apr 9, 2019·0 cites·12 claims
- 1449US2015279790A1Prevention of warping during handling of chip-on-waferIBM·Filed 2015·Application pending·0 cites
- 1549US2015279812A1Prevention of warping during handling of chip-on-waferIBM·Filed 2015·Application pending·0 cites
- 1648US9373545B2Semiconductor structure including a through electrode, and method for forming the sameIBM·Filed 2015·Granted Jun 21, 2016·0 cites·6 claims
- 1747US9099315B2Mounting structure and mounting structure manufacturing methodIBM·Filed 2014·Granted Aug 4, 2015·0 cites·8 claims
- 1843US9941230B2Electrical connecting structure between a substrate and a semiconductor chipIBM·Filed 2015·Granted Apr 10, 2018·0 cites·15 claims
- 1942US7682936B2Reduction in thickness of semiconductor component on substrateIBM·Filed 2007·Granted Mar 23, 2010·0 cites·13 claims
- 2038US9520375B2Method of forming a solder bump on a substrateIBM·Filed 2015·Granted Dec 13, 2016·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →