Inventor · disambiguated record
Yang Li
Also filed as: LI YANG · LI YANG-YONG
25 granted patents·16 pending applications·189 citations·filing 2008–2024
95Inventor score
Top patents by PatentIndex Score
41 records- 0192US7760498B2Electronic apparatus with air guiding elementHONGFUJIN PREC IND SHENZHEN·Filed 2008·Granted Jul 20, 2010·26 cites·16 claims
- 0291US8164900B2Enclosure of electronic deviceSun hong-zhi·Filed 2010·Granted Apr 24, 2012·23 cites·13 claims
- 0388US8462497B2Computer systemLI YANG·Filed 2011·Granted Jun 11, 2013·19 cites·15 claims
- 0488US7835149B2Computer enclosure with airflow guideHONGFUJIN PREC IND SHENZHEN·Filed 2008·Granted Nov 16, 2010·19 cites·13 claims
- 0585US8335082B2Heat dissipating apparatusSun hong-zhi·Filed 2011·Granted Dec 18, 2012·10 cites·20 claims
- 0685US7675753B2Mounting apparatus for heat sinkHONGFUJIN PREC IND SHENZHEN·Filed 2008·Granted Mar 9, 2010·13 cites·17 claims
- 0784US8514574B2Heat dissipating apparatusFU SHUANG·Filed 2011·Granted Aug 20, 2013·10 cites·19 claims
- 0884US8300405B2Airflow ductSun hong-zhi·Filed 2010·Granted Oct 30, 2012·10 cites·8 claims
- 0984US8253068B2Method of cutting bulk amorphous alloyYUAN XIAO-BO·Filed 2010·Granted Aug 28, 2012·7 cites·10 claims
- 1083US8456829B2All-in-one computerCHEN CHEN·Filed 2010·Granted Jun 4, 2013·8 cites·19 claims
- 1180US8564948B2Electronic deviceLI YANG·Filed 2011·Granted Oct 22, 2013·6 cites·19 claims
- 1280US7929304B2Heat dissipation apparatusHONGFUJIN PREC IND SHENZHEN·Filed 2009·Granted Apr 19, 2011·9 cites·12 claims
- 1379US8070559B1Zr-rich bulk amorphous alloy article and method of surface grinding thereofLI YANG-YONG·Filed 2010·Granted Dec 6, 2011·5 cites·11 claims
- 1478US8014146B2Computer system with airflow blocking plateHONGFUJIN PREC IND SHENZHEN·Filed 2010·Granted Sep 6, 2011·6 cites·20 claims
- 1577US8072763B2Printed circuit board assemblyLI YANG·Filed 2010·Granted Dec 6, 2011·5 cites·16 claims
- 1674US8848363B2Heat dissipation systemCHEN CHEN·Filed 2011·Granted Sep 30, 2014·4 cites·14 claims
- 1774US8469774B2Amorphous alloy component and surface treating method for making sameLI YANG-YONG·Filed 2011·Granted Jun 25, 2013·1 cites·4 claims
- 1872US8072762B2Printed circuit board assemblyLI YANG·Filed 2010·Granted Dec 6, 2011·4 cites·14 claims
- 1969US2024401220A1Sealing solution kit, two-step sealing method using the same and articleHENKEL AG & CO KGAA·Filed 2024·Application pending·0 cites
- 2063US9517501B2Sheet forming tool and a method for the manufacture of a corrugated sheetCHIN KIMWAH·Filed 2011·Granted Dec 13, 2016·4 cites·18 claims
- 2157US2024431073A1Chassis, electronic apparatus and chassis exhaust methodBITMAIN TECH INC·Filed 2024·Application pending·0 cites
- 2255US2024414837A1Computing apparatus and heat dissipation apparatusBITMAIN TECH INC·Filed 2024·Application pending·0 cites
- 2355US2024389267A1Cooling apparatus and electronic deviceBITMAIN TECH INC·Filed 2024·Application pending·0 cites
- 2447US12049897B2Baffle plate for compressor, compressor, and refrigeration apparatusGUANGDONG MEIZHI COMPRESSOR CO LTD·Filed 2021·Granted Jul 30, 2024·0 cites·11 claims
- 2547US8072757B2Heat dissipation apparatusCAO LIANG-LIANG·Filed 2009·Granted Dec 6, 2011·0 cites·14 claims
- 2647US2010230074A1Heat dissipation apparatusHONGFUJIN PREC IND SHENZHEN·Filed 2009·Application pending·0 cites
- 2747US2010002373A1Heat dissipating device for electronic deviceHONGFUJIN PREC IND SHENZHEN·Filed 2009·Application pending·0 cites
- 2846US2009213549A1Heat sink assemblyHONGFUJIN PREC IND SHENZHEN·Filed 2008·Application pending·0 cites
- 2946US2010014244A1Thermal device for heat generating sourceHONGFUJIN PREC IND SHENZHEN·Filed 2008·Application pending·0 cites
- 3045US2009168330A1Electronic device with airflow guiding ductHONGFUJIN PREC IND SHENZHEN·Filed 2008·Application pending·0 cites
- 3144US12327830B2Structured connector for interconnecting device componentsLONGI GREEN ENERGY TECHNOLOGY CO LTD·Filed 2020·Granted Jun 10, 2025·0 cites·17 claims
- 3244US2010147495A1Heat dissipation apparatusHONGFUJIN PREC IND SHENZHEN·Filed 2009·Application pending·0 cites
- 3343US8804329B2Computer system including a heat dissipating apparatusLI YANG·Filed 2011·Granted Aug 12, 2014·0 cites·9 claims
- 3442US11971036B2Compressor and refrigeration device with an oil return channel having a first relative distance to an inner-side wallGUANGDONG MEIZHI PREC MFG CO·Filed 2021·Granted Apr 30, 2024·0 cites·11 claims
- 3541US2013003300A1Electronic device with case for electro magnetic compatibilityHON HAI PREC IND CO LTD·Filed 2012·Application pending·0 cites
- 3640US2012120595A1Computer system with airflow guiding ductSun hong-zhi·Filed 2011·Application pending·0 cites
- 3739US12317609B2Method of forming a device structureLONGI GREEN ENERGY TECHNOLOGY CO LTD·Filed 2020·Granted May 27, 2025·0 cites·15 claims
- 3839US2011304978A1Enclosure of electronic deviceSun hong-zhi·Filed 2010·Application pending·0 cites
- 3936US2012044634A1Heat dissipation apparatusHUANG GUO-HE·Filed 2010·Application pending·0 cites
- 4035US2012044641A1Electronic deviceZhu xiao-su·Filed 2011·Application pending·0 cites
- 4134US2012107536A1Amorphous alloy housing and method for making sameLI YANG-YONG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →