US2010230074A1PendingUtilityA1

Heat dissipation apparatus

Assignee: HONGFUJIN PREC IND SHENZHENPriority: Mar 13, 2009Filed: Jun 15, 2009Published: Sep 16, 2010
Est. expiryMar 13, 2029(~2.6 yrs left)· nominal 20-yr term from priority
Inventors:Yang Li
H10W 40/73H10W 40/43
47
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A heat dissipation apparatus includes a base with a bottom surface contacting a heat source, and a fin assembly disposed on a top surface of the base. The fin assembly includes a first heat dissipation member, and a second heat dissipation member symmetric with respect to a centerline of the fin assembly. Each heat dissipation member comprises a plurality of parallel fins vertically disposed on a top surface of the base, and a heat pipe passing through the plurality of parallel fins.

Claims

exact text as granted — not AI-modified
1 . A heat dissipation apparatus for dissipating heat from a heat source, comprising:
 a base comprising a bottom surface configured for contacting the heat source; and   a fin assembly comprising a first heat dissipation member and a second heat dissipation member, each symmetric with respect to a centerline of the fin assembly; wherein each heat dissipation member comprises a plurality of parallel fins vertically disposed on a top surface of the base, and a heat pipe passing through the plurality of parallel fins.   
   
   
       2 . The heat dissipation apparatus of  claim 1 , wherein a lower portion of each heat pipe is disposed on the base, and passed through the plurality of parallel fins. 
   
   
       3 . The heat dissipation apparatus of  claim 2 , wherein the base comprises a heat conducting plate and two fixing plates; the heat conducting plate comprising two slots that receive the corresponding heat pipe, and two column protrusions disposed on one side of the slots respectively; each fixing plate comprising a slot thereon corresponding to the heat pipe, and a column receiving hole that engages the column protrusion; wherein the lower portion of each heat pipe is horizontally fixed in the corresponding slots on the heat conducting plate and fixing plate, and the column protrusions are received in the corresponding column receiving holes to fix the heat pipes on the base. 
   
   
       4 . The heat dissipation apparatus of  claim 3 , further comprising two supporting members disposed on the base to support the fin assembly, each supporting member comprising a middle portion secured on one side of the heat conducting plate, and a bottom surface of the corresponding fixing plate, two bent supporting legs extended from two sides of each supporting member, and a fixing hole disposed on a distal end of each supporting leg. 
   
   
       5 . A heat dissipation apparatus, comprising:
 a fan configured to generate airflow through the heat dissipation apparatus; and   a heat sink configured to contact a heat source, comprising:
 a base with a bottom surface contacting the heat source; 
 a fin assembly comprising a first heat dissipation member and a second heat dissipation member, each symmetric with respect to a centerline of the fin assembly; 
   
     wherein each heat dissipation member comprises a plurality of parallel fins vertically disposed on a top surface of the base, and a heat pipe passing through the plurality of parallel fins; a corner of first and second heat dissipation members is arcuate. 
   
   
       6 . The heat dissipation apparatus of  claim 5 , wherein each heat dissipation member comprises a plurality of parallel fins vertically disposed on a top surface of the base, and a heat pipe passing through the plurality of parallel fins. 
   
   
       7 . The heat dissipation apparatus of  claim 6 , wherein the fan is round and mounted to the air inlet of the heat sink. 
   
   
       8 . The heat dissipation apparatus of  claim 6 , wherein the fan is mounted to the heat sink by glue.

Join the waitlist — get patent alerts

Track US2010230074A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.