Inventor · disambiguated record
Yuji Nishitani
Also filed as: NISHITANI YUJI
13 granted patents·2 pending applications·241 citations·filing 2000–2010
92Inventor score
Top patents by PatentIndex Score
15 records- 0191US6803324B2Semiconductor device and its manufacturing methodSONY CORP·Filed 2002·Granted Oct 12, 2004·68 cites·15 claims
- 0289US7193311B2Multi-chip circuit module and method for producing the sameSONY CORP·Filed 2004·Granted Mar 20, 2007·52 cites·16 claims
- 0389US6919226B2Method for producing a multi-chip circuit module including a multi-layered wiring section utilizing a via-on-via structureSONY CORP·Filed 2002·Granted Jul 19, 2005·50 cites·10 claims
- 0479US7880317B2Semiconductor device and method of manufacturing semiconductor deviceSONY CORP·Filed 2006·Granted Feb 1, 2011·10 cites·12 claims
- 0578US7420127B2Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateSONY CORP·Filed 2006·Granted Sep 2, 2008·6 cites·14 claims
- 0676US8315011B2Disk drive device improved in stiffness of fluid dynamic bearingNISHITANI YUJI·Filed 2010·Granted Nov 20, 2012·5 cites·17 claims
- 0776US6637105B1Method of manufacturing a multilayer printed wiring boardSONY CORP·Filed 2000·Granted Oct 28, 2003·23 cites·13 claims
- 0871US8599516B2Disk drive device in which reduction in unbalanced amount can be adjustedNISHITANI YUJI·Filed 2010·Granted Dec 3, 2013·3 cites·16 claims
- 0968US6831357B2Circuit substrate device, method for producing the same, semiconductor device and method for producing the sameSONY CORP·Filed 2003·Granted Dec 14, 2004·11 cites·4 claims
- 1061US7436682B2Wiring board, electronic component mounting structure, and electronic component mounting methodSONY COMPUTER ENTERTAINMENT INC·Filed 2006·Granted Oct 14, 2008·2 cites·9 claims
- 1154US7053315B2Junction structure and junction method for conductive projectionSONY CORP·Filed 2004·Granted May 30, 2006·8 cites·6 claims
- 1252US7138294B2Circuit substrate device, method for producing the same, semiconductor device and method for producing the sameSONY CORP·Filed 2004·Granted Nov 21, 2006·3 cites·20 claims
- 1351US2007293038A1Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateSONY CORP·Filed 2007·Application pending·0 cites
- 1442US2008185712A1Semiconductor device and method for manufacturing the sameSONY CORP·Filed 2008·Application pending·0 cites
- 1540US7288724B2Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateSONY CORP·Filed 2003·Granted Oct 30, 2007·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →