Inventor · disambiguated record
Shankar S. Pennathur
Also filed as: PENNATHUR SHANKAR · PENNATHUR SHANKAR S
12 granted patents·4 pending applications·50 citations·filing 2012–2023
88Inventor score
Top patents by PatentIndex Score
16 records- 0192US10356903B1System-in-package including opposing circuit boardsAPPLE INC·Filed 2018·Granted Jul 16, 2019·9 cites·20 claims
- 0292US9485870B2Methods for transparent encapsulation and selective encapsulationAPPLE INC·Filed 2013·Granted Nov 1, 2016·12 cites·20 claims
- 0388US9820373B2Thermal solutions for system-in-package assemblies in portable electronic devicesAPPLE INC·Filed 2014·Granted Nov 14, 2017·15 cites·10 claims
- 0485US11266010B2Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devicesAPPLE INC·Filed 2019·Granted Mar 1, 2022·3 cites·18 claims
- 0583US10709018B2System-in-package including opposing circuit boardsAPPLE INC·Filed 2019·Granted Jul 7, 2020·3 cites·21 claims
- 0680US9949359B2Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devicesAPPLE INC·Filed 2014·Granted Apr 17, 2018·4 cites·16 claims
- 0772US9618564B2Printed circuits with sacrificial test structuresAPPLE INC·Filed 2014·Granted Apr 11, 2017·2 cites·19 claims
- 0867US10966321B2System-in-package including opposing circuit boardsAPPLE INC·Filed 2020·Granted Mar 30, 2021·0 cites·20 claims
- 0967US9913412B2Shielding structures for system-in-package assemblies in portable electronic devicesAPPLE INC·Filed 2014·Granted Mar 6, 2018·2 cites·16 claims
- 1054US2024074066A1Transfer molding systems for semiconductor device packagingAPPLE INC·Filed 2023·Application pending·0 cites
- 1152US2018220525A1Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devicesAPPLE INC·Filed 2018·Application pending·0 cites
- 1250US2015359099A1Low area over-head connectivity solutions to sip moduleAPPLE INC·Filed 2014·Application pending·0 cites
- 1346US9484228B2Simultaneous independently controlled dual side PCB molding techniqueAPPLE INC·Filed 2014·Granted Nov 1, 2016·0 cites·13 claims
- 1444US10147685B2System-in-package devices with magnetic shieldingAPPLE INC·Filed 2017·Granted Dec 4, 2018·0 cites·30 claims
- 1540US2014038357A1Singulated ic stiffener and de-bond processARNOLD SHAWN X·Filed 2012·Application pending·0 cites
- 1634US9839133B2Low-area overhead connectivity solutions to SIP moduleAPPLE INC·Filed 2015·Granted Dec 5, 2017·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →