Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices

Abstract

A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.

What is claimed is: 
     
         1 . An electronic device comprising:
 a substrate; and   a system in package assembly including:
 a plurality of subsystems including a plurality of electronic components, 
 a plurality of trenches, each trench separating adjacent subsystems and including two walls, wherein the walls are perpendicular to the substrate, and 
 a multi-layer thin film stack including portions disposed in each of the plurality of trenches, wherein the portions are perpendicular to the substrate. 
   
     
     
         2 . The electronic device of  claim 1 , wherein the system in package assembly and the substrate are assembled into a single package 
     
     
         3 . The electronic device of  claim 1 , wherein the plurality of subsystems further comprises a plurality of mechanical or optical components. 
     
     
         4 . The electronic device of  claim 1 , wherein some of the plurality of electronic components produce RF or magnetic shield interference and some of the plurality of electronic components are sensitive to interference received from sources external from the electronic device. 
     
     
         5 . The electronic device of  claim 1 , wherein at least one of the plurality of subsystems includes audio components, at least one of the plurality of subsystems includes communications components, and at least one of the plurality of subsystems includes memory and processor components. 
     
     
         6 . The electronic device of  claim 1 , wherein the multi-layer thin film stack includes one or more of an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. 
     
     
         7 . The electronic device of  claim 1 , wherein at least one layer included in the multi-layer film stack includes two separate portions disposed in each of the plurality of trenches. 
     
     
         8 . The electronic device of  claim 7 , wherein ends of the two portions contact the substrate. 
     
     
         9 . The electronic device of  claim 1 , wherein at least one layer included in the multi-layer film stack includes only one portion disposed in each of the plurality of trenches. 
     
     
         10 . The electronic device of  claim 9 , wherein the at least one layer includes another portion not disposed in the plurality of trenches, the another portion being perpendicular to the one portion. 
     
     
         11 . The electronic device of  claim 1 , wherein the multi-layer film stack includes a first layer and a second layer, the first layer located closer to the substrate than the second layer, and the first layer including two portions located closer to the walls than two portions from the second layer. 
     
     
         12 . The electronic device of  claim 1 , further comprising an insulating layer that is both electrically insulating and thermally conductive. 
     
     
         13 . A method of forming an electronic device, the method comprising:
 providing a substrate;   forming a system in package assembly including:
 providing a plurality of electronic components, 
 locating the plurality of electronic components in a plurality of subsystems, 
 forming a plurality of trenches such that each trench is separated from adjacent subsystems, wherein the plurality of trenches includes two walls that are perpendicular to the substrate, and 
 forming a multi-layer film stack such that included portions are disposed in each of the plurality of trenches and perpendicular to the substrate. 
   
     
     
         14 . The method of forming an electronic device of  claim 13 , further comprising assembling the system in package assembly and the substrate into a single package. 
     
     
         15 . The method of forming an electronic device of  claim 13 , wherein providing the plurality of electronic components includes providing one or more of audio components, communication components, memory, and processor components. 
     
     
         16 . The method of forming an electronic device of  claim 13 , wherein forming the multi-layer stack includes forming one or more of an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. 
     
     
         17 . The method of forming an electronic device of  claim 13 , wherein forming the multi-layer stack includes forming two portions of a layer of the multi-layer stack such that the two portions contact the substrate. 
     
     
         18 . The method of forming an electronic device of  claim 17 , wherein forming the multi-layer stack further includes forming another portion not disposed in the plurality of trenches such that the another portion is perpendicular to the two portions. 
     
     
         19 . A method for shielding interference in an electronic device, the method comprising:
 blocking interference using portions of a multi-layer film stack in a system in package to or from components in a plurality of subsystems, the plurality of subsystems included in the system in package assembly,   wherein the portions of the multi-layer film stack are disposed in a plurality of trenches, the portions of the multi-layer film stack perpendicular to the substrate, and walls of the plurality of trenches perpendicular to the substrate.   
     
     
         20 . The method for shielding interference in an electronic device of  claim 19 , wherein blocking interference includes:
 blocking RF or magnetic shield interference produced by some of the components; and   blocking some of the components from interference received from sources external from the electronic device.