Inventor · disambiguated record
Kung-Wei Lee
Also filed as: LEE KUNG-WEI
6 granted patents·1 pending application·14 citations·filing 2013–2023
75Inventor score
Technology areasH10P
Top patents by PatentIndex Score
7 records- 0191US9589969B1Semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 7, 2017·10 cites·20 claims
- 0282US12507472B2Method of making polysilicon structure including protective layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 0376US10014207B2Method of manufacturing dielectric layers of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 3, 2018·4 cites·16 claims
- 0471US11855086B2Polysilicon structure including protective layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 0560US10957697B2Polysilicon structure including protective layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 23, 2021·0 cites·14 claims
- 0655US10050035B2Method of making protective layer over polysilicon structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 14, 2018·0 cites·20 claims
- 0742US2015048477A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →