Inventor · disambiguated record
David J. Lischka
Also filed as: LISCHKA DAVID J · LISCHKA DAVID JAMES
16 granted patents·6 pending applications·172 citations·filing 2003–2024
93Inventor score
Files withAPPLIED MATERIALS INC18BENNETT DOYLE E1BENVEGNU DOMINIC J1LISCHKA DAVID J1LISCHKA DAVID JAMES1
Top patents by PatentIndex Score
22 records- 0195US7210980B2Sealed polishing pad, system and methodsAPPLIED MATERIALS INC·Filed 2005·Granted May 1, 2007·20 cites·12 claims
- 0295US7112119B1Sealed polishing pad methodsAPPLIED MATERIALS INC·Filed 2006·Granted Sep 26, 2006·29 cites·13 claims
- 0394US7044832B2Load cup for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2004·Granted May 16, 2006·61 cites·26 claims
- 0493US7621798B1Reducing polishing pad deformationAPPLIED MATERIALS INC·Filed 2007·Granted Nov 24, 2009·19 cites·16 claims
- 0591US7998358B2Peak-based endpointing for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Aug 16, 2011·14 cites·18 claims
- 0688US7163437B1System with sealed polishing padAPPLIED MATERIALS INC·Filed 2006·Granted Jan 16, 2007·12 cites·15 claims
- 0778US9056383B2Path for probe of spectrographic metrology systemAPPLIED MATERIALS INC·Filed 2013·Granted Jun 16, 2015·3 cites·15 claims
- 0871US2025269488A1Electrical connection for chemical mechanical polishing carrier headAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0969US8591698B2Peak-based endpointing for chemical mechanical polishingBENVEGNU DOMINIC J·Filed 2011·Granted Nov 26, 2013·1 cites·13 claims
- 1067US2024139906A1Control of carrier head sweep and platen shapeAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1165US8454408B2Load cup substrate sensingLISCHKA DAVID JAMES·Filed 2009·Granted Jun 4, 2013·3 cites·20 claims
- 1264US11919120B2Polishing system with contactless platen edge controlAPPLIED MATERIALS INC·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 1363US8734202B2Load cup substrate sensingAPPLIED MATERIALS INC·Filed 2013·Granted May 27, 2014·1 cites·20 claims
- 1460US9799578B2Peak-based endpointing for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2016·Granted Oct 24, 2017·0 cites·12 claims
- 1560US6905399B2Conditioning mechanism for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Jun 14, 2005·8 cites·26 claims
- 1659US9564377B2Peak-based endpointing for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2013·Granted Feb 7, 2017·0 cites·12 claims
- 1753US9013176B2Methods and apparatus for sensing a substrate in a load cupLISCHKA DAVID J·Filed 2012·Granted Apr 21, 2015·1 cites·21 claims
- 1853US8287330B1Reducing polishing pad deformationBENNETT DOYLE E·Filed 2009·Granted Oct 16, 2012·0 cites·18 claims
- 1952US2023356355A1Polishing head with local inner ring downforce controlAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2052US2020101576A1Platen assembly and method of assembling a platen assemblyAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2148US2019030677A1Method of identifying and tracking roll to roll polishing pad materials during processingAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 2247US2014242883A1Determination of wafer angular position for in-sequence metrologyAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →