Inventor · disambiguated record
Huan-Ping Su
Also filed as: SU HUAN-PING
9 granted patents·7 pending applications·102 citations·filing 1994–2018
88Inventor score
Files withULTRATERA CORP6UNIBAND ELECTRONIC CORP4NAT SCIENCE COUNCIL1ULTRA TERA CORP1ULTRATERA CORP TAIWAN R O C1
Top patents by PatentIndex Score
16 records- 0171USD570800SISM-band printed antenna for a portion of a circuit boardUNIBAND ELECTRONIC CORP·Filed 2006·Granted Jun 10, 2008·21 cites·1 claims
- 0267US5504021AMethod of fabricating thin O/N/O stacked dielectric for high-density DRAMsUNITED MICROELECTRONICS CORP·Filed 1994·Granted Apr 2, 1996·26 cites·2 claims
- 0366US10492238B2Remote controller and paring method thereofUNIBAND ELECTRONIC CORP·Filed 2018·Granted Nov 26, 2019·2 cites·7 claims
- 0464US6933178B1Method of manufacturing semiconductor packages and a clamping device for manufacturing a semiconductor packageULTRATERA CORP·Filed 2004·Granted Aug 23, 2005·13 cites·16 claims
- 0562US6897566B2Encapsulated semiconductor package free of chip carrierULTRA TERA CORP·Filed 2002·Granted May 24, 2005·12 cites·15 claims
- 0660US6709894B2Semiconductor package and method for fabricating the sameULTRATERA CORP·Filed 2002·Granted Mar 23, 2004·10 cites·12 claims
- 0756US6956741B2Semiconductor package with heat sinkULTRATERA CORP·Filed 2003·Granted Oct 18, 2005·8 cites·16 claims
- 0850US6859056B2Test fixture for semiconductor package and test method of using the sameULTRATERA CORP·Filed 2002·Granted Feb 22, 2005·7 cites·12 claims
- 0944US2010272261A1Data Security Transmission Wirelessly with Zigbee ChipsUNIBAND ELECTRONIC CORP·Filed 2009·Application pending·0 cites
- 1037US2019068305A1Broadcasting communication system, broadcasting relay device and broadcasting relay methodUNIBAND ELECTRONIC CORP·Filed 2017·Application pending·0 cites
- 1135US2004004277A1Semiconductor package with reinforced substrate and fabrication method of the substrateFiled 2002·Application pending·0 cites
- 1235US2004070083A1Stacked flip-chip packageFiled 2003·Application pending·0 cites
- 1332US6063661AMethod for forming a bottom polysilicon electrode of a stacked capacitor for DRAMNAT SCIENCE COUNCIL·Filed 1996·Granted May 16, 2000·3 cites·10 claims
- 1428US2003190826A1Test fixture for semiconductor packages and test method of using the sameULTRATERA CORP·Filed 2002·Application pending·0 cites
- 1527US2003197269A1Test fixture for semiconductor packagesULTRATERA CORP·Filed 2002·Application pending·0 cites
- 1627US2003155907A1Test method and test device for integrated circuitsULTRATERA CORP TAIWAN R O C·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →