Assignee
ULTRATERA CORP
TW·22 granted patents·7 pending applications·490 citations·filing 2002–2004
Top patents by PatentIndex Score
29 records- 0194US7224073B2Substrate for solder jointULTRATERA CORP·Filed 2004·Granted May 29, 2007·88 cites·9 claims
- 0294US6713856B2Stacked chip package with enhanced thermal conductivityULTRATERA CORP·Filed 2002·Granted Mar 30, 2004·98 cites·7 claims
- 0384US6683385B2Low profile stack semiconductor packageULTRATERA CORP·Filed 2002·Granted Jan 27, 2004·39 cites·22 claims
- 0482US6614660B1Thermally enhanced IC chip packageULTRATERA CORP·Filed 2002·Granted Sep 2, 2003·67 cites·4 claims
- 0580US6849932B2Double-sided thermally enhanced IC chip packageULTRATERA CORP·Filed 2002·Granted Feb 1, 2005·31 cites·15 claims
- 0680US6753480B2Printed circuit board having permanent solder maskULTRATERA CORP·Filed 2002·Granted Jun 22, 2004·30 cites·13 claims
- 0775US7091623B2Multi-chip semiconductor package and fabrication method thereofULTRATERA CORP·Filed 2004·Granted Aug 15, 2006·22 cites·7 claims
- 0873US6555919B1Low profile stack semiconductor packageULTRATERA CORP·Filed 2002·Granted Apr 29, 2003·20 cites·30 claims
- 0964US6933178B1Method of manufacturing semiconductor packages and a clamping device for manufacturing a semiconductor packageULTRATERA CORP·Filed 2004·Granted Aug 23, 2005·13 cites·16 claims
- 1062US6911604B2Bonding pads of printed circuit board capable of holding solder balls securelyULTRATERA CORP·Filed 2002·Granted Jun 28, 2005·10 cites·7 claims
- 1161US6857865B2Mold structure for package fabricationULTRATERA CORP·Filed 2002·Granted Feb 22, 2005·10 cites·11 claims
- 1260US6709894B2Semiconductor package and method for fabricating the sameULTRATERA CORP·Filed 2002·Granted Mar 23, 2004·10 cites·12 claims
- 1359US6964888B2Semiconductor device and method for fabricating the sameULTRATERA CORP·Filed 2004·Granted Nov 15, 2005·5 cites·9 claims
- 1458US6822337B2Window-type ball grid array semiconductor packageULTRATERA CORP·Filed 2002·Granted Nov 23, 2004·9 cites·12 claims
- 1557US6879030B2Strengthened window-type semiconductor packageULTRATERA CORP·Filed 2002·Granted Apr 12, 2005·9 cites·13 claims
- 1656US6956741B2Semiconductor package with heat sinkULTRATERA CORP·Filed 2003·Granted Oct 18, 2005·8 cites·16 claims
- 1752US6968613B2Fabrication method of circuit boardULTRATERA CORP·Filed 2002·Granted Nov 29, 2005·4 cites·11 claims
- 1851US6710434B1Window-type semiconductor package and fabrication method thereofULTRATERA CORP·Filed 2002·Granted Mar 23, 2004·5 cites·7 claims
- 1950US6859056B2Test fixture for semiconductor package and test method of using the sameULTRATERA CORP·Filed 2002·Granted Feb 22, 2005·7 cites·12 claims
- 2046US7080447B2Method of manufacturing solder mask of printed circuit boardULTRATERA CORP·Filed 2004·Granted Jul 25, 2006·2 cites·13 claims
- 2142US6825064B2Multi-chip semiconductor package and fabrication method thereofULTRATERA CORP·Filed 2002·Granted Nov 30, 2004·1 cites·10 claims
- 2241US6869824B2Fabrication method of window-type ball grid array semiconductor packageULTRATERA CORP·Filed 2002·Granted Mar 22, 2005·2 cites·14 claims
- 2338US2003184979A1Circuit board free of photo-sensitive material and fabrication method of the sameULTRATERA CORP·Filed 2002·Application pending·0 cites
- 2436US2003234276A1Strengthened bonding mechanism for semiconductor packageULTRATERA CORP·Filed 2002·Application pending·0 cites
- 2535US2003204949A1Method of forming connections on a conductor pattern of a printed circuit boardULTRATERA CORP·Filed 2002·Application pending·0 cites
- 2631US2004124176A1Palsma etchingm methodULTRATERA CORP·Filed 2003·Application pending·0 cites
- 2728US2003190826A1Test fixture for semiconductor packages and test method of using the sameULTRATERA CORP·Filed 2002·Application pending·0 cites
- 2827US2003197269A1Test fixture for semiconductor packagesULTRATERA CORP·Filed 2002·Application pending·0 cites
- 2923US2004194695A1Resin coated carrier fabrication method and the related apparatus for the fabricationULTRATERA CORP·Filed 2004·Application pending·0 cites
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