Inventor · disambiguated record
Sian Yong Khoo
Also filed as: KHOO SIAN YONG
5 granted patents·1 pending application·302 citations·filing 1997–2004
85Inventor score
Top patents by PatentIndex Score
6 records- 0193US6720666B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 13, 2004·91 cites·53 claims
- 0290US5956233AHigh density single inline memory moduleTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 21, 1999·132 cites·20 claims
- 0388US6692987B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 17, 2004·60 cites·74 claims
- 0473US7320933B2Double bumping of flexible substrate for first and second level interconnectsMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 22, 2008·15 cites·19 claims
- 0550US7112048B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 26, 2006·4 cites·33 claims
- 0640US2004036170A1Double bumping of flexible substrate for first and second level interconnectsFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →