Inventor · disambiguated record
Qui T. Le
Also filed as: LE QUI T
8 granted patents·10 pending applications·110 citations·filing 2002–2020
87Inventor score
Top patents by PatentIndex Score
18 records- 0193US7524427B2Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substratesMICROFABRICA INC·Filed 2005·Granted Apr 28, 2009·15 cites·3 claims
- 0291US7109118B2Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structuresMICROFABRICA INC·Filed 2004·Granted Sep 19, 2006·45 cites·69 claims
- 0387US7288178B2Methods of and apparatus for making high aspect ratio microelectromechanical structuresMICROFABRICA INC·Filed 2002·Granted Oct 30, 2007·30 cites·20 claims
- 0484US7517462B2Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substratesMICROFABRICA INC·Filed 2005·Granted Apr 14, 2009·10 cites·13 claims
- 0582US7488686B2Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structuresMICROFABRICA INC·Filed 2006·Granted Feb 10, 2009·6 cites·26 claims
- 0676US10676836B2Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substratesMICROFABRICA INC·Filed 2018·Granted Jun 9, 2020·0 cites·27 claims
- 0775US9546431B2Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substratesMICROFABRICA INC·Filed 2014·Granted Jan 17, 2017·1 cites·16 claims
- 0874US2020354848A1Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric SubstratesMICROFABRICA INC·Filed 2020·Application pending·0 cites
- 0971US2017247807A1Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric SubstratesMICROFABRICA INC·Filed 2016·Application pending·0 cites
- 1057US2009194425A1Electrochemical Fabrication Methods Including Use of Surface Treatments to Reduce Overplating and/or Planarization During Formation of Multi-layer Three-Dimensional StructuresMICROFABRICA INC·Filed 2009·Application pending·0 cites
- 1157US2008121343A1Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric SubstratesMICROFABRICA INC·Filed 2008·Application pending·0 cites
- 1254US7172684B2Methods of and apparatus for making high aspect ratio microelectromechanical structuresMICROFABRICA INC·Filed 2002·Granted Feb 6, 2007·3 cites·23 claims
- 1354US2010270165A1Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric SubstratesMICROFABRICA INC·Filed 2010·Application pending·0 cites
- 1449US2005176238A1Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substratesMICROFABRICA INC·Filed 2005·Application pending·0 cites
- 1549US2005194258A1Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substratesMICROFABRICA INC·Filed 2005·Application pending·0 cites
- 1648US2005230261A1Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substratesCOHEN ADAM L·Filed 2005·Application pending·0 cites
- 1748US2005215046A1Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substratesCOHEN ADAM L·Filed 2005·Application pending·0 cites
- 1837US2004007469A1Selective electrochemical deposition methods using pyrophosphate copper plating baths containing ammonium salts, citrate salts and/or selenium oxideMEMGEN CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →